Abstract
Due to the increase in the use of thick film in electronic circuitry it can be considered a relatively new technique. Certainly it appears to be the printed circuit board of the future.
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© 1976 C. E. Jowett
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Jowett, C.E. (1976). Failure Modes. In: The Engineering of Microelectronic Thin and Thick Films. Palgrave, London. https://doi.org/10.1007/978-1-349-02684-5_13
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DOI: https://doi.org/10.1007/978-1-349-02684-5_13
Publisher Name: Palgrave, London
Print ISBN: 978-1-349-02686-9
Online ISBN: 978-1-349-02684-5
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