Abstract
The need to produce electronic equipment of increasing complexity with improved reliability, reduced size and less weight has generated a variety of microelectronic technologies. Three basic technologies have emerged:
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1.
Silicon integrated circuits in which transistors, diodes, resistors, and capacitors are formed in a solid block of silicon.
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2.
Thick film circuits in which resistive, conductive, and dielectric inks are screen printed and fired on insulating substrates to form interconnected resistors and capacitors.
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3.
Thin film circuits in which resistive, conductive, and dielectric materials are vacuum deposited onto insulating substrates to form interconnected resistors and capacitors.
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References
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© 1971 Macmillan Publishers Limited
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Holt, W. (1971). Thin Film Circuits. In: Waller, W.F. (eds) Component Reliability. Macmillan Engineering Evaluations. Palgrave, London. https://doi.org/10.1007/978-1-349-01185-8_12
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DOI: https://doi.org/10.1007/978-1-349-01185-8_12
Publisher Name: Palgrave, London
Print ISBN: 978-1-349-01187-2
Online ISBN: 978-1-349-01185-8
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