Abstract
Synthetic polymers can be divided into two broad groups according to their behaviour when exposed to heat and pressure. All polymers soften and flow (ie become plastic) under such conditions. One group undergoes only the physical change of softening, and on cooling resumes a solid state. This process of softening and solidifying can be performed repeatedly and the materials in this group are known as thermoplastic polymers. Materials in the second group soften on heating, but in addition undergo an irreversible chemical reaction and ultimately solidify into a form which cannot again be softened by heating. These materials are known as thermosetting polymers.
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References
A A K Whitehouse, E G K Pritchett, and G. Barnett, Phenolic resins. 3rd edition. London, Iliffe Books Ltd, 1967.
C P Vale, and W G K Taylor, Aminoplastics. London, Iliffe Books Ltd, 1964.
B Parkyn, F Lamb, and B V Clifton, Polyesters. Volume 2. Unsaturated polyesters and polyester plasticisers. London, Iliffe Books Ltd, 1967.
H L Lee, and K O Neville, Epoxy resins. 2nd edition. New York, McGraw Hill Book Co, 1967.
D V B Parker, and L N Phillips, Polyurethanes; chemistry, technology and properties. London, Iliffe Books Ltd, 1964.
G G Freeman, Silicones. An introduction to their chemistry and applications. London, Iliffe Books Ltd, 1962.
E E Frisch, Heat resistant thermosetting silicone plastics for transfer molding. Proc Soc Plastics Engineers 20th Annual Technical Conference, Atlantic City, 1964 Paper 14–2.
F J Lockhart, and G J Kookootsedes, Plastics for packaging. Microelectronics, Vol 1, No 2. January 1968. p. 18.
A L Ashton, and J E H Hayward, Diallyl phthalate, melamine phenolic and epoxide moulding materials. Trans J Plastics Institute, Vol 34, October 1966. p 250.
J T Long, and L P Hoover, A heat resistant study of alkyd and related molding compounds. Proc Soc Plastics Engrs 19th Annual Technical Conference, Los Angeles, 1963. Paper 18–4.
N R Segro and H H Beacham, New DAP resins for low pressure molding encapsulation of electronic parts Proc 9th Electrical Insulation Conference, Boston, 1969. pp 98–100.
C F Martino, Why use a thermosetting molding material for electrical parts. Proc Soc Plastics Engrs Regional Technical Conference, Milwaukee, May 1964. pp 1–9.
A R Smith, and C P Vale, Emphasis on injection of thermosets. Plastics and Rubber Weekly, November 13, 1970. p 17.
C A Harper, Electronic packaging with resins. New York, McGraw Hill Book Co, 1961.
A E Molzon, Encapsulation of electronic parts in plastics (a review). US Clearinghouse for Federal, Scientific and Technical Information. Plastec Report 29, 1967.
A E Javitz, Cast resin embedments of circuit subunits and components. Electrical Mfg, Vol 53, September 1951.
C V Lundberg, Correlation of shrinkage pressures developed in epoxy, polyurethane and silicone casting resins with inductance measurements on embedded electronic components. Ind Eng Chem Prod Res and Dev, Vol 6, No 2, June 1967. p 92.
C A Harper, Plastics for electronics. Chicago, Kiver Publications, 1964.
L Montesano; Room temperature curing polyurethane casting compounds. Ind Eng Chem Prod Res and Dev, Vol 3, No 2, June 1964, p 133.
A Hainline, Silicone encapsulants and potting compounds for electrical and electronic uses. J Appl Poly Sci Applied Polymer Symposia No 14. New York, Interscience Publishers 1970, pp 51–60.
F E Dummer, Embedded and printed circuits. Electrical Mfg, Vol 55, May 1953.
J F Formo, and R E Isleifson, Producing special properties in plastics with fillers. Proc Soc Plastics Engrs Regional Technical Conference, Fort Wayne, May 1959.
L I Solomon, and E Fottis, Conformal coating of microelectronic assemblies. Insulation, Vol 14, No 10, October 1968. p 85.
C F Coombs, Printed circuits handbook. New York, McGraw Hill Book Co, 1967.
J A Scarlett, Printed circuit boards for microelectronics. London, Van Nostrand Reinhold Co, 1970.
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© 1971 Palgrave Macmillan, a division of Macmillan Publishers Limited
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Young, D. (1971). Thermosetting Plastics. In: Waller, W.F. (eds) Electronics Design Materials. Macmillan Engineering Evaluations. Palgrave Macmillan, London. https://doi.org/10.1007/978-1-349-01176-6_8
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DOI: https://doi.org/10.1007/978-1-349-01176-6_8
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