Mounting & Interconnection Materials
The demands of high-speed sophisticated circuitry, notably ICs, are presenting a new set of interface problems, particularly when associated with switch contact faces, edge connectors, through-hole plating materials, conductor plating finishes, and solders. In each of these fields difficulties may arise from an inadequate knowledge of the basic physical and electrical properties of the interface materials, and the techniques associated with specific applications. For instance, a gold plating thickness found necessary to ensure good wear characteristics on a digital switch track would prove disastrous when used as a basis for a soldered joint. Before discussing the specific applications, the basic physical, chemical and electrical characteristics of the materials now being used are summarised.
KeywordsSolder Joint Print Circuit Board Platinum Group Metal Gold Alloy Whisker Growth
Unable to display preview. Download preview PDF.
- 1.French Patent 1 231 410: 1960; 1 299 226: 1960.Google Scholar
- 2.J J Miles, ATE Journal, 1962, 18 63.Google Scholar
- 4.F H Reid, Plating, 1965, 52, 531.Google Scholar
- 5.USP 2895889/2, 895, 890, 1959.Google Scholar
- 6.F H Reid, Trans IMF 1970, 118.Google Scholar
- 7.F H Reid, Trans IMF 1970, 120.Google Scholar
- 8.G Cavanaugh and J Langan. Effects of Solution Impurities on Tin-Lead Electrodeposits. Am Electroplaters Society, Symposium on Plating in the Electronics Industry, Boston, Feb 1969.Google Scholar