Mounting & Interconnection Materials

  • H. R. Shemilt
Part of the Macmillan Engineering Evaluations book series (MECS)


The demands of high-speed sophisticated circuitry, notably ICs, are presenting a new set of interface problems, particularly when associated with switch contact faces, edge connectors, through-hole plating materials, conductor plating finishes, and solders. In each of these fields difficulties may arise from an inadequate knowledge of the basic physical and electrical properties of the interface materials, and the techniques associated with specific applications. For instance, a gold plating thickness found necessary to ensure good wear characteristics on a digital switch track would prove disastrous when used as a basis for a soldered joint. Before discussing the specific applications, the basic physical, chemical and electrical characteristics of the materials now being used are summarised.


Solder Joint Print Circuit Board Platinum Group Metal Gold Alloy Whisker Growth 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Palgrave Macmillan, a division of Macmillan Publishers Limited 1971

Authors and Affiliations

  • H. R. Shemilt
    • 1
  1. 1.Technograph and Telegraph LimitedUK

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