Abstract
Encapsulation is normally the term used to describe the embedding of parts, either electrical or electro-mechanical, to effect one or more of the following:
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1.
Mechanical Protection.
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2.
Electrical Safety.
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3.
Immunity against environment, ie humidity, shock, vibration, corrosion/chemical attack, fire.
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4.
Ease of testing and insertion during assembly.
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References
Transfer Moulding Encapsulating Materials. K Graham Walker, G I Mech E. Electronic Components, August/September 1968.
US Patent No 3 411 122 Electrical Resistance Element and Method of Fabricating. 12 November 1968.
Study on the Thick Film Resistor Abrupt Change by Resin Packaging. K Asama, Y Mishimura and H Sasaki. Hybrid Microelectronics Symposium 1969. Statler Hilton, Dallas, Texas.
Epoxy Resins, Their Applications and Technology. Henry Lee and Kris Neville. McGraw Hill.
Epoxy Resins, Irving Skeist. Reinhold.
Def 5011. Climatic and Durability Testing of Service Components. August 1960. HMSO.
BS9000. 1967. Specification for General Requirements for Electronic Parts of Assessed Quality. BSI.
Plastic IC’s. Get Foot in Military Door. Electronics, May 1970. p 127.
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© 1971 Palgrave Macmillan, a division of Macmillan Publishers Limited
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Newport, D.J. (1971). Encapsulation. In: Waller, W.F. (eds) Electronics Design Materials. Macmillan Engineering Evaluations. Palgrave Macmillan, London. https://doi.org/10.1007/978-1-349-01176-6_23
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DOI: https://doi.org/10.1007/978-1-349-01176-6_23
Publisher Name: Palgrave Macmillan, London
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