• D. J. Newport
Part of the Macmillan Engineering Evaluations book series (MECS)


Encapsulation is normally the term used to describe the embedding of parts, either electrical or electro-mechanical, to effect one or more of the following:
  1. 1.

    Mechanical Protection.

  2. 2.

    Electrical Safety.

  3. 3.

    Immunity against environment, ie humidity, shock, vibration, corrosion/chemical attack, fire.

  4. 4.

    Ease of testing and insertion during assembly.



Resin System Volume Resistivity Silicone Resin Insulation Resistance Powder Moulding 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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  1. 1.
    Transfer Moulding Encapsulating Materials. K Graham Walker, G I Mech E. Electronic Components, August/September 1968.Google Scholar
  2. 2.
    US Patent No 3 411 122 Electrical Resistance Element and Method of Fabricating. 12 November 1968.Google Scholar
  3. 3.
    Study on the Thick Film Resistor Abrupt Change by Resin Packaging. K Asama, Y Mishimura and H Sasaki. Hybrid Microelectronics Symposium 1969. Statler Hilton, Dallas, Texas.Google Scholar
  4. 4.
    Epoxy Resins, Their Applications and Technology. Henry Lee and Kris Neville. McGraw Hill.Google Scholar
  5. 5.
    Epoxy Resins, Irving Skeist. Reinhold.Google Scholar
  6. 6.
    Def 5011. Climatic and Durability Testing of Service Components. August 1960. HMSO.Google Scholar
  7. 7.
    BS9000. 1967. Specification for General Requirements for Electronic Parts of Assessed Quality. BSI.Google Scholar
  8. 8.
    Plastic IC’s. Get Foot in Military Door. Electronics, May 1970. p 127.Google Scholar

Copyright information

© Palgrave Macmillan, a division of Macmillan Publishers Limited 1971

Authors and Affiliations

  • D. J. Newport
    • 1
  1. 1.Matthey Printed Products LimitedUK

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