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Inverse Identification of Boundary Constants for Electronic Packages Using Modified Micro Genetic Algorithm and Reduced-basis Method

  • Z. L. Yang
  • J. H. Lee
  • G. R. Liu
  • A. T. Patera
  • K. Y. Lam

Abstract

New inverse analysis method is presented to identify boundary constants for heat conduction in microelectronic packages. This approach adopts a modified Micro Genetic Algorithm (μG?) in finding the global optimum of constants. A reduced-basis approach is introduced in the forward heat transfer analysis so as to significantly improve the efficiency in calculation. Different identification procedures are employed to identify heat convective constants of a typical microelectronic package. Comparisons between different algorithms are performed. Results show that the use of reduced-basis method together with modified μGA outperforms significantly a conventional method. The present method of constant identification is ideal for practical applications. It is efficient enough even for online analysis of both forward and inverse problem.

Keywords

Genetic Algorithm Inverse Analysis Electronic Package General Finite Element Method Microelectronic Package 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag London 2002

Authors and Affiliations

  • Z. L. Yang
    • 1
  • J. H. Lee
    • 2
  • G. R. Liu
    • 3
  • A. T. Patera
    • 2
  • K. Y. Lam
    • 3
  1. 1.Singapore-MIT Alliance (SMA)National University of SingaporeSingapore
  2. 2.SMA Fellow, Department of Mechanical EngineeringMITUSA
  3. 3.SMA Fellow, Singapore-MIT AllianceNational University of SingaporeSingapore

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