Skip to main content
SpringerLink
Log in

Inverse Identification of Boundary Constants for Electronic Packages Using Modified Micro Genetic Algorithm and Reduced-basis Method

  • Conference paper
Adaptive Computing in Design and Manufacture V

  • 170 Accesses

Abstract

New inverse analysis method is presented to identify boundary constants for heat conduction in microelectronic packages. This approach adopts a modified Micro Genetic Algorithm (μG?) in finding the global optimum of constants. A reduced-basis approach is introduced in the forward heat transfer analysis so as to significantly improve the efficiency in calculation. Different identification procedures are employed to identify heat convective constants of a typical microelectronic package. Comparisons between different algorithms are performed. Results show that the use of reduced-basis method together with modified μGA outperforms significantly a conventional method. The present method of constant identification is ideal for practical applications. It is efficient enough even for online analysis of both forward and inverse problem.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Bar-Cohen, T. Elperin and R. Eliasi, “ØjC characterization of chip packagesjustification, limitations and future”. IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 12, No. 4, 1989, pp724–731.

    Article  Google Scholar 

  2. Bar-Cohen and W. B. Krueger, “Thermal characterization of chip packagesevolutionary development of compact models”. IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 20, No. 4, 1997, pp399–410.

    Google Scholar 

  3. A. Ortega, A. Aranyosi, A. Griffin, S. West and D. Edwards, “Compact thermal models of conduction cooled packages”, IEEE Fifth Annual SEMITHERM Symposium, 1999, pp 221–230.

    Google Scholar 

  4. Y. Maday. A. T. Patera and J. Peraire, ‘A general formation for a posteriori bounds for output functional of partial differential equations; application to the eigenvalue problem. C. R. Acad. Sei. Paris, Serie I, 328:823–829,1999.

    MathSciNet  MATH  Google Scholar 

  5. D. V. Rovas and A. T. Patera, ‘Reduced-Basis Output-Bound Methods for Elliptic Partial Differential Equations’ Second ISSMO/AIAA Internet Conference on Approximations and Fast Reanalysis in Engineering Optimization, May 2000.

    Google Scholar 

  6. J. H. Holland, “Adaptation in natural and artificial systems”, The University of Michigan Press, Ann Arbor, 1975.

    Google Scholar 

  7. Gen, M. and Cheng, R. W., “Genetic Algorithm and Engineering Design”, John Wiley & Sons, Inc. New York, 1997

    Google Scholar 

  8. F. P. Incropera and D. P. De Witt, “Fundamentals of heat and mass transfer”, 4th Edition, John Wiley & Sons.

    Google Scholar 

  9. ASE Group, Taiwan “Product Information”, <http://www.acegroup.com.tw>

Download references

Author information

Authors and Affiliations

  1. Singapore-MIT Alliance (SMA), National University of Singapore, E4-4-10, 4 Engineering Drive 3, 117576, Singapore

    Z. L. Yang

  2. SMA Fellow, Department of Mechanical Engineering, MIT, MA, 02139, USA

    J. H. Lee & A. T. Patera

  3. SMA Fellow, Singapore-MIT Alliance, National University of Singapore, 117576, Singapore

    G. R. Liu & K. Y. Lam

Authors
  1. Z. L. Yang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. J. H. Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. G. R. Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. A. T. Patera
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. K. Y. Lam
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Z. L. Yang .

Editor information

Editors and Affiliations

  1. CEMS University of the West of England, Frenchay Campus, Coldharbour Lane, Bristol, BS16 1QY, UK

    I. C. Parmee PhD

Rights and permissions

Reprints and permissions

Copyright information

© 2002 Springer-Verlag London

About this paper

Cite this paper

Yang, Z.L., Lee, J.H., Liu, G.R., Patera, A.T., Lam, K.Y. (2002). Inverse Identification of Boundary Constants for Electronic Packages Using Modified Micro Genetic Algorithm and Reduced-basis Method. In: Parmee, I.C. (eds) Adaptive Computing in Design and Manufacture V. Springer, London. https://doi.org/10.1007/978-0-85729-345-9_13

Download citation

  • DOI: https://doi.org/10.1007/978-0-85729-345-9_13

  • Publisher Name: Springer, London

  • Print ISBN: 978-1-85233-605-9

  • Online ISBN: 978-0-85729-345-9

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics

Search

Navigation