Abstract
The complexity of the physics of electromigration and the stress-induced voiding can be seen in Chap. 2. In order to model the physics realistically in today’s interconnects so as to obtain better understanding of the physics and to identify key parameters, FEM is needed as pointed out in Chap. 2. To begin the discussion on FEM applications in electromigration and stress-induced voiding, let us have a basic understanding on the FEM. For readers familiar with FEM, this chapter may be skipped.
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Tan, C.M., Gan, Z., Li, W., Hou, Y. (2011). Introduction and General Theory of Finite Element Method. In: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections. Springer Series in Reliability Engineering. Springer, London. https://doi.org/10.1007/978-0-85729-310-7_3
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DOI: https://doi.org/10.1007/978-0-85729-310-7_3
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