Introduction and General Theory of Finite Element Method

  • Cher Ming Tan
  • Zhenghao Gan
  • Wei Li
  • Yuejin Hou
Part of the Springer Series in Reliability Engineering book series (RELIABILITY)


The complexity of the physics of electromigration and the stress-induced voiding can be seen in  Chap. 2. In order to model the physics realistically in today’s interconnects so as to obtain better understanding of the physics and to identify key parameters, FEM is needed as pointed out in  Chap. 2. To begin the discussion on FEM applications in electromigration and stress-induced voiding, let us have a basic understanding on the FEM. For readers familiar with FEM, this chapter may be skipped.


Finite Element Method Stress Analysis Joule Heating Finite Element Formulation Partial Differential Equation 
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Copyright information

© Springer-Verlag London Limited  2011

Authors and Affiliations

  • Cher Ming Tan
    • 1
  • Zhenghao Gan
    • 2
  • Wei Li
    • 3
  • Yuejin Hou
    • 1
    • 4
  1. 1.School of Electrical & Electronic EngineeringNanyang Technological UniversitySingaporeSingapore
  2. 2.Technology Research & DevelopmentSemiconductor Manufacturing International (Shanghai) Corp.ShanghaiPeople’s Republic of China
  3. 3.Singapore Institute of Manufacturing TechnologySingaporeSingapore
  4. 4.SingaporeSingapore

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