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Development of Physics-Based Modeling for ULSI Interconnections Failure Mechanisms: Electromigration and Stress-Induced Voiding

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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Part of the book series: Springer Series in Reliability Engineering ((RELIABILITY))

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Abstract

In this chapter, we present a comprehensive review on the physics-based modeling of EM phenomena in ULSI interconnections over the last three decades. In the evolution of the physics-based modeling, some aspects of the physics are dropped for simplification, and some are added to accommodate new understanding on the EM physics as well as for the new development of the interconnect technology. With the continuous change in the metallization system and materials, the aspects of physics that have been dropped may become important again, and new physics might also occur with these changes in metallization system. Here, we re-examine the justification of dropping or adding various physical aspects in the EM modeling during their evolution and their implications on the future interconnect system.

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Authors and Affiliations

  1. School of Electrical & Electronic Engineering, Nanyang Technological University, Nanyang Avenue 50, Singapore, 639798, Singapore

    Cher Ming Tan & Yuejin Hou

  2. Technology Research & Development, Semiconductor Manufacturing International (Shanghai) Corp., 18 Zhangjiang Road, Pudong New Area, 201203, Shanghai, People’s Republic of China

    Zhenghao Gan

  3. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore

    Wei Li

  4. #10-226 BLK156, Hougang Street 11, 530156, Singapore, Singapore

    Yuejin Hou

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  1. Cher Ming Tan
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  2. Zhenghao Gan
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Correspondence to Cher Ming Tan .

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Tan, C.M., Gan, Z., Li, W., Hou, Y. (2011). Development of Physics-Based Modeling for ULSI Interconnections Failure Mechanisms: Electromigration and Stress-Induced Voiding. In: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections. Springer Series in Reliability Engineering. Springer, London. https://doi.org/10.1007/978-0-85729-310-7_2

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  • DOI: https://doi.org/10.1007/978-0-85729-310-7_2

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