Pure tin is currently the most widely employed lead-free finish for plating of component terminals despite its propensity to spontaneous whisker formation. Whiskers are filamentary crystals, conductive and mechanically strong, measuring up to a few millimetres, though the common variety observed on matt tin finish on copper substrate was hardly ever reported to exceed 0.5 mm. A positive stress gradient within the Sn layer, that is either a lowering compressive or an increasing tensile stress towards the root of a whisker, is reputed as the driving force for whisker formation. The formation of whisker is a major reliability concern for the electronic industry. Whisker-related failures in electric and electronic hardware have been reported since the 1940, and the failure risk cannot be overlooked especially in modern electronic systems. Understanding the tin whisker phenomenon and further developing mitigation strategies and test methods for evaluating whisker performance are all important tasks to be fulfilled in the future.


Intermetallic Layer Whisker Growth Whisker Formation Conformal Coating Mitigation Practice 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



I am indebted to Pascal Oberndorff for his criticism and remarks to the draft manuscript. I am especially grateful to Jacob Klerk for his considerate encouragement during the short life of the Elfnet Tin Whisker Group.


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© Springer-Verlag London Limited 2011

Authors and Affiliations

  1. 1.Politecnico di Milano, Dipartimento di ChimicaMateriali, Ingegneria Chimica “Giulio Natta”MilanoItaly

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