Thermal Capability of Components

  • C. Zardini
  • J.-Y. Deletage


For surface mount components, the most used alloy family for reflow soldering, the SnAgCu, shows a liquidus temperature ranging between 217 and 221°C, and it is agreed that during reflow the coldest solder joint temperature should be no less than 230°C. Accordingly, the components are submitted to temperatures notably higher than those to which they were submitted with the Pb technology and much of them had to be re-qualified. What can one say today in connection with the thermal compatibility of components with the lead-free soldering processes? To answer this question, we examined more than 125 web sites of components makers and we also learned from the members of the Components Technical Experts Group. The obtained results are exposed below by distinguishing active and passive components.


Solder Alloy Passive Component Molding Compound Reflow Process Plastic Package 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1. 1.
    IPC/JEDEC J-STD-020D.1 March 2008 Moisture/Reflow Classification for Nonhermetic Solid State Surface Mount Devices Downloadable from
  2. 2.
    Blattau N, Wright J, Schatz R, Hillman C (2009) Robustness of surface-mount aluminum electrolytic capacitors subjected to Pb-free reflow Accessed September 30, 2009
  3. 3.
    IEC 60317 Standards (International Electrotechnical Commission) Specifications for particular of winding wires.
  4. 4.
    NEMA MW 1000-2003 (National Electrical Manufacturers Association) Definitions, type designations, dimensions, construction, performance, and methods of testing magnet wire generally used in the winding of coils for electrical equipment. Downloadable from
  5. 5.
    IEC 60317-51, NEMA MW 82 Polyurethane enamelled round copper wire, class 180.
  6. 6.
    Klein Wassink RJ Soldering in electronics, 2nd edn. Electrochemical publications Ltd.
  7. 7.
    IEC 60068-2-58 Standard Test method for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices.
  8. 8.

Copyright information

© Springer-Verlag London Limited 2011

Authors and Affiliations

  1. 1.Laboratoire IMSTalenceFrance

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