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Abstract

Interface delamination and popcorn cracking are among the most common reasons for mechanical damage in plastic packaging. Many investigations have shown the popcorn phenomenon to be a closely linked process of delamination of the pad/encapsulant interface, moisture diffusion, vapor pressure build-up, and popcorn cracking. A short survey on the phenomenon is given.

Keywords

Flexural Strength Moisture Diffusion Thermal Mismatch Molding Compound Interface Delamination 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag London Limited 2011

Authors and Affiliations

  1. 1.Fraunhofer ENAS, Micro Materials Center Berlin and ChemnitzChemnitzGermany

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