Interface delamination and popcorn cracking are among the most common reasons for mechanical damage in plastic packaging. Many investigations have shown the popcorn phenomenon to be a closely linked process of delamination of the pad/encapsulant interface, moisture diffusion, vapor pressure build-up, and popcorn cracking. A short survey on the phenomenon is given.


Flexural Strength Moisture Diffusion Thermal Mismatch Molding Compound Interface Delamination 
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© Springer-Verlag London Limited 2011

Authors and Affiliations

  1. 1.Fraunhofer ENAS, Micro Materials Center Berlin and ChemnitzChemnitzGermany

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