Delamination is not only a problem with lead-free soldering but since the problem accelerates with heat, it has been more common, and therefore extra care has to be taken. The design and material choice have a major impact of the delamination risk for a board. It is important to order lead-free boards and if possible avoid buried vias and reduce large copper planes. Another important design aspect is the placement of components. A low delta T during soldering will reduce risk of delamination.


Print Circuit Board Moisture Absorption Copper Foil Terahertz Radiation Peel Strength 
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Copyright information

© Springer-Verlag London Limited 2011

Authors and Affiliations

  1. 1.TÜBİTAK UZAYODTU Kampüsü, AnkaraTurkey
  2. 2.ERICSSON ABStockholmSweden

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