Abstract
Delamination is not only a problem with lead-free soldering but since the problem accelerates with heat, it has been more common, and therefore extra care has to be taken. The design and material choice have a major impact of the delamination risk for a board. It is important to order lead-free boards and if possible avoid buried vias and reduce large copper planes. Another important design aspect is the placement of components. A low delta T during soldering will reduce risk of delamination.
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© 2011 Springer-Verlag London Limited
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Baylakoglu, I., Hedin, E. (2011). PCB Delamination. In: Grossmann, G., Zardini, C. (eds) The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. Springer, London. https://doi.org/10.1007/978-0-85729-236-0_12
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DOI: https://doi.org/10.1007/978-0-85729-236-0_12
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Publisher Name: Springer, London
Print ISBN: 978-0-85729-235-3
Online ISBN: 978-0-85729-236-0
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