Delamination is not only a problem with lead-free soldering but since the problem accelerates with heat, it has been more common, and therefore extra care has to be taken. The design and material choice have a major impact of the delamination risk for a board. It is important to order lead-free boards and if possible avoid buried vias and reduce large copper planes. Another important design aspect is the placement of components. A low delta T during soldering will reduce risk of delamination.
KeywordsPrint Circuit Board Moisture Absorption Copper Foil Terahertz Radiation Peel Strength
- 1.Assurance Technology Corporation (http://www.assurancetechnology.com/FA3.asp)