Advertisement

Artifacts in Transmission Electron Microscopy

  • Jeanne Ayache
  • Luc Beaunier
  • Jacqueline Boumendil
  • Gabrielle Ehret
  • Danièle Laub
Chapter

Abstract

An artifact is damage caused by a preparation technique and can easily be confused with the sample’s microstructure. Artifacts can be due to mechanical, chemical, ionic, or physical action. During TEM observation, especially in a TEM/STEM, other artifacts may be produced due to irradiation under the electron beam.

Keywords

Thermal Effect Electronic Irradiation Mechanical Polishing Chemical Fixation Crystal Network 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Bibliography

  1. Ayache, J. and Albarede, P.H. (1994). New Application of Klepeis Ion Mill Free Sample Preparation to YBCO System Thin Films and Bulk Ceramics, P. H. ICEM 13, 1. Les Editions de Physique, Paris, 1023–1024.Google Scholar
  2. Ayache J, Albarede PH (1995) TEM cross section preparation by ionless tripod polisher method applied to YBCO superconducting multilayer thin films and bulk ceramics. Ultramicroscopy 60:195–206CrossRefGoogle Scholar
  3. Ayache J, Thorel A, Lesueur J, Dahmen U (1998) Characterization of a threedimensional grain boundary topography in a YBa2Cu3O7 thin film bicrystal grown on a SrTiO3 substrate. J Appl Phys 84(9):4921–4928CrossRefGoogle Scholar
  4. Ayache J, Kisielowski C, Kilaas R, Passerieux G, Lartigue-Korinek S (2005) Determination of the atomic structure of a _13 SrTiO3 grain boundary. J Mater Sci 40:3091–3100CrossRefGoogle Scholar
  5. Böhler S (1970) Artefacts and Specimen preparationfaults in freeze etch technology. Balzers AG, LiechtensteinGoogle Scholar
  6. Bouchet D, Colliex C (2003) Experimental study of ELNES at grain boundaries in alumina: Intergranular radiation damage effects on Al–L23 and O–K edges. Ultramicroscopy 96:139–152CrossRefGoogle Scholar
  7. Bouleau, D. (1974). La préparation des répliques destinées à l’observation des échantillons d’acier en MET-IRSID, 1996. Dalmai-Imelik G., Leclercq Ch., Mutin J., J. de Microscopie, 20, 123.Google Scholar
  8. Cavalier A, Spehner D, Humbel BM (eds) (2008) Handbook of Cryo-Preparation Methods for Electron Microscopy. CRC Press, Boca RatonGoogle Scholar
  9. Crang RFE, Klomparens KL (1988) Artefacts in Biological Electron Microscopy. Plenum Press, New YorkGoogle Scholar
  10. Kato NI, Kohno Y, Saka H (1999) Side-wall damage in a transmission electron microscopy specimen of crystalline Si pepared by focused ion beam etching. J Vac Sci Technol A 17(4):1201–1204CrossRefGoogle Scholar
  11. McCaffrey JP, Phaneuf MW, Madsen LD (2001) Surface damage formation during ion-beam thinning of samples for transmission électron microscopy. Ultramicroscopy 87:97–104CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  • Jeanne Ayache
    • 1
  • Luc Beaunier
    • 2
  • Jacqueline Boumendil
    • 3
  • Gabrielle Ehret
    • 4
  • Danièle Laub
    • 5
  1. 1.Laboratoire de Microscopie Moléculaire et CellulaireInstitut Gustave Roussy Unité mixte CNRS-UMR8126-IGRVillejuif CXFrance
  2. 2.Labo. Interfaces et Systèmes ElectrochimiquesUniversité Paris VI UPR 15 CNRS Boîte courrier 133Paris CX 05France
  3. 3.Centre de Microscopie Electronique Appliquée à la Biologie et à la GéologieUniversité Lyon IVilleurbanne CXFrance
  4. 4.Inst. Physique et Chimie des MatériauxUniversité Strasbourg CNRS-UMR 7504Strasbourg CX 2France
  5. 5.Faculté des Sciences de Base Centre Interdisciplinaire de Microscopie ElectroniqueEcole Polytechnique Fédérale de LausanneLausanneSwitzerland

Personalised recommendations