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Integrated Metrology (IM) History at a Glance

  • Moshe Finarov
  • David Scheiner
  • Gabi Sharon
Chapter

Abstract

In the early 1990 s, when oxide CMP was penetrating into semiconductor manufacturing, the process suffered from significant instability and non-uniformity, thus requiring intensive process control. This process control was implemented by using two methods:

Keywords

Optical Model Technology Node Line Array Automate Process Control Polished Wafer 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

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Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.Nova Measuring Instruments Ltd.RehovotIsrael

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