CMP for Cu Processing

  • Manabu TsujimuraEmail author


CMP (chemical mechanical polisher) is now regarded as an essential process among semiconductor device manufacturing processes. This CMP was first introduced by IBM in the early 1980s for planarization of logic devices [1]. Figure 23.11 shows trends in CMP adoption relative to device trends such as finer nodes and larger wafers. As previously mentioned, in days of 200 mm wafer with 500–350 technical nodes, CMP was not adopted. Since late 250 nm nodes or since 180 nodes, CMP began to prevail primarily in the area of logic device manufacturing. In the days of 300 mm wafers and 130 nm nodes, CMP came to be regarded as essential.


Removal Rate Step Height Chemical Mechanical Polishing Electro Chemical Planarization Technology 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1. 1.
    Kashiwagi, M.: CMP Science, 26 (1977)Google Scholar
  2. 2.
    Shin-Chieh, C.; et al.: Pattern on Planarization Efficiency of Cu Electropolishing. Jpn. J. Appl. Phys. 41, 7332 (2002)CrossRefGoogle Scholar
  3. 3.
    Economicos, L.; Wang, X.; Sakamoto, X.; Ong, P.; Naujok, M.; Knarr, R.; Chen, L.; Moon, Y.; Neo, S.; Salfelder, J.; Duboust, A.; Manens, A.; Lu, W.; Shrauti, S.; Liu, F.; Tsai, S.; and Swart, W.: Integrated Electro-Chemical Mechanical Polishing(Ecmp) for Future Generation. IEEE IITC, 233 (2004)Google Scholar
  4. 4.
    Pallinti, J.; Lakshminarayanan, S.; Barth, W.; Wright, P.; Lu, M.; Reder, S.; Kwak, L.; Catabay, W.; Wang, D.; and Ho, F.: An Overview of Stress Free Polishing of Cu with Ultra Low-k(k<2.0) Films. IEEE IITC, 83 (2003)Google Scholar
  5. 5.
    Sato, S.; Yasuda, Z.; Ishihara, M.; Komai, N.; Ohtorii, H.; Yoshio, A.; Segawa, Y.; Horikoshi, H.; Ohoka, Y.; Tai, K.; Takahashi, S.; and Nogami, T.: Newly Developed Electro-chemical polishing process of copper inlaid in frangile low-k dielectrics. IEEE IEDM, 4.4.1 (2001)Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.Ebara CorporationTokyoJapan
  2. 2.Ebara CorporationFujusawa-shiJapan

Personalised recommendations