CMP for Cu Processing



CMP (chemical mechanical polisher) is now regarded as an essential process among semiconductor device manufacturing processes. This CMP was first introduced by IBM in the early 1980s for planarization of logic devices [1]. Figure 23.11 shows trends in CMP adoption relative to device trends such as finer nodes and larger wafers. As previously mentioned, in days of 200 mm wafer with 500–350 technical nodes, CMP was not adopted. Since late 250 nm nodes or since 180 nodes, CMP began to prevail primarily in the area of logic device manufacturing. In the days of 300 mm wafers and 130 nm nodes, CMP came to be regarded as essential.


Removal Rate Step Height Chemical Mechanical Polishing Electro Chemical Planarization Technology 


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© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.Ebara CorporationTokyoJapan
  2. 2.Ebara CorporationFujusawa-shiJapan

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