Low-κ Materials and Development Trends



Though low-κ materials have been actively investigated by many researchers, target values of ITRS (International Technology Roadmap for Semiconductor) have not achieved. To reduce RC delay, both lower resistance wiring material, copper, and low-κ material are necessary. Especially for recent IC chips, ratio of BEP (Back End Process) has rapidly increased with increasing wiring layers. This chapter reviews low-κ materials and proposes future development.


Dielectric Constant Chemical Vapor Deposition Chemical Mechanical Polishing Graphite Layer Chemical Mechanical Polishing Process 


  1. 1.
    Nikkei Microdevices, 8, 175 (2000)Google Scholar
  2. 2.
    Electronic Journal, 12, 8 (2003)Google Scholar
  3. 3.
    Provisional Publication No.2002-25223, 2522 4 (Toshiba)Google Scholar
  4. 4.
    Provisional Publication No.9-237831(Toshiba)Google Scholar
  5. 5.
    Provisional Publication No. 2000-269327 (Toshiba)Google Scholar
  6. 6.
    Nikkei Microdevices, 4, 130 (1997)Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.Institute of Science and TechnologyKanto Gakuin UniversityYokohamaJapan

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