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Metallic Coatings on Dielectric Substrates

  • M. Pietsch
  • M. Mennig

Abstract

Metallic coatings are used in a broad variety of applications, for protective as well as for decorative purposes (e.g. for sanitation, mirrors, gold coatings for jewelry etc.) and also as electric conductive layers for the manufacture of printed circuit boards. Depending on the kind of substrate different coating technologies have been developed.

Keywords

Print Circuit Board Copper Layer Dielectric Substrate Metallic Coating Electroless Copper 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 1.
    Th. Burkhart, Entwicklung und strukturelle Charakterisierung eines Ormocer-Adhäsivs zur Laminierung von Polyimid mit Kupferfolien für elektronische Anwendungen, Ph.D. thesis, University of Saarland and Institut fuer Neue Materialien gem. GmbH, Saarbruecken/Germany (1993)Google Scholar
  2. 2.
    R. Kasemann, Th. Burkhart, H. Schmidt, Sol-Gel Synthesis of a diepoxy-crosslinked ormocer adhesive for Cu/Polyimide sealing systems, in: Sol-Gel Science and Technology, Ceram. Trans., 55,307(1995)Google Scholar
  3. 3.
    M. Toyonaga, Direct plating technology in PWB, in: Proceedings of the 2nd International Symp. on Technology, Applications in Electronics, 2, 46 (1993)Google Scholar
  4. 4.
    N. Kanani, B. Bressel, A direct electrolytic copper plating process for printed circuit boards, Congress of the International Union for Electrodeposition and Surface Finishing, Sao Paulo, 3 1260(1992)Google Scholar
  5. 5.
    S. P. Murarka, St. W. Hymes, Copper metallization for ULSI and beyond, Critical Reviews in Solid State and Materials Sciences, 20, 87 (1995)CrossRefGoogle Scholar
  6. 6.
    R. R. Thomas, J. M. Park, Vapor Phase Deposition of Palladium for Electroless Copper Plating, J. Electrochem. Soc., 136, 1661 (1989)CrossRefGoogle Scholar
  7. 7.
    R. L. Jackson, Pd24/Poly(acrylic acid) Thin films as Catalysts for Electroless Copper Deposition: Mechanism of Catalyst Formation, J. Electrochem. Soc, 137, 95 (1990)CrossRefGoogle Scholar
  8. 8.
    U.-J. Timpe, H. Baumann, Photopolymere-Prinzipien und Anwendungen, Photopolymere-Prinzipien und Anwendungen, 1. Autl. Leipzig: Dt. Verl. für Grundstoffind. (1988)Google Scholar
  9. 9.
    W.J. Dressick, CS. Dulcey, J.H. Georger, GS. Calabrese, J.M. Calvert, Covalent Binding of Pd Catalysts to Ligating Self-Assembled Monolayer Films for Selective Electroless Metal Deposition, J. Electrochem. Soc, 141, 210 (1994)CrossRefGoogle Scholar
  10. 10.
    D. W. Himler, J.A. Alzapiedi, Preparing Plastics for Plating, J.A. Alzapiedi, SPE Journal, 29, 57 (1973)Google Scholar
  11. 11.
    II. Giesecke, G. D. Wolf, J. Probst, K. Schuster, Verfahren zur Verbesserung der Haftfestigkeit von stromlos abgeschiedenen Metallschichten auf Kunststoffoberflächen, European Patent Office, EP 0255012 B1, Anmeldetag: 20.07.87Google Scholar
  12. 12.
    II. Giesecke, G. D. Wolf, D. Meier, Herstellung flexibler Schaltungen mit Bayprint — eine zukunftsweisende Technologie, Galvanotechnik, 84, 570 (1993)Google Scholar
  13. 13.
    D. Meier, Neue Variante zum Herstellen kleberfreier, metallisierter und flexibler Schaltungsträger, Metalloberfläche, 48, 266 (1994)Google Scholar
  14. 14.
    M. Pietsch, Entwicklung und Charakterisierung eines Pd-haltigen Sol-Gel-Beschichtungs-materials mit Eignung zur Strukturierung im Tampondruck sowie zur nachfolgenden stromlosen Kupferabscheidung, Ph.D. thesis, University of Saarland and Institut für Neue Materialien gem. GmbH, Saarbrücken/Germany, August 2001Google Scholar
  15. 15.
    I-I. K. Schmidt, Nanoparticles for ceramic nanocomposite processing, Molecular Crystals and Liquid Crystals, 353, 165 (2000)CrossRefGoogle Scholar
  16. 16.
    U. Schubert, S. Amber-Schwab, B. Breitscheidel, H. Schmidt, US-Patent 67/482.860 (1990)Google Scholar
  17. 17.
    B. Breitscheidel. J. Zieder, U. Schubert, Nanometer-Sized, Uniform Metal Particles in a SiO2 Matrix by Sol-Gel Processing of Metal Complexes, Chem. Mater. 3, 559 (1991)CrossRefGoogle Scholar
  18. 18.
    H. Schmidt, M. Mennig, Th. Burkhardt, C. Fink-Straube, G. Jonschker, M. Schmitt, A. Bauer, US-Patent 5731091Google Scholar
  19. 19.
    T. Burkhart, M. Mennig, H. Schmidt, A. Licciulli, Nano Sized Pd Particles in a SiOM2 Matrix by Sol-Gel-Process, MRS Proceedings, volume 346, 779 (1994)CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media New York 2004

Authors and Affiliations

  • M. Pietsch
  • M. Mennig

There are no affiliations available

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