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Future Trend of Conductive Adhesive Technology

  • Yi Li
  • Daniel Lu
  • C. P. Wong
Chapter

Abstract

As can be seen from previous chapters, tremendous progress has been made to improve the conductive adhesive technology for ICAs, ACA, and NCA.

Keywords

Contact Resistance Silver Flake Organic Electronic Device High Filler Loading Copper Filler 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

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    J. Wu, K. Moon, and C. P. Wong, “Self-Alignment Feasibility Study and Contact Resistance Improvement of Electrically Conductive Adhesives (ECAs),”Proceedings of 51st Electronic Components and Technology Conference, Orlando, FL, pp. 571–575, 2001.Google Scholar
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    K. Moon, J. Wu, and C. P. Wong, “Study on Self-Alignment Capability of Electrically Conductive Adhesives (ECAs) for Flip-Chip Application,”Proceedings of International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Braselton, GA, pp. 341–346, 2001.Google Scholar
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    Y. S. Lin and S. S. Chiu, “Effects of Oxidation and Particle Shape on Critical Volume Fractions of Silver-Coated Copper Powders in Conductive Adhesives for Microelectronic Applications,”Polymer Engineering and Science, 44, 2075–2082, 2004.CrossRefGoogle Scholar
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    M. Angelopoulos, “Conducting Polymers in Microelectronics,”IBM Journal of Research and Development, 45, 57–75, 2001.CrossRefGoogle Scholar
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    Y. Li, M. J. Yim, K. Moon, R. W. Zhang, and C. P. Wong, “Development of Novel, Flexible, Electrically Conductive Adhesives for Next-Generation Microelectronics Interconnect Applications,”Proceedings of 58th IEEE Electronic Components and Technology Conference, pp. 1272–1276, 2008.Google Scholar
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    H. Y. Ouyang and Y. Yang, “Conducting Polymer as Transparent Electric Glue,”Advanced Materials, 18, 2141–2144, 2006.CrossRefGoogle Scholar
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    M. J. Yim and K. W. Paik, “Effect of Nonconducting Filler Additions on ACA Properties and the Reliability of ACA Flip-Chip on Organic Substrates,”IEEE Transactions on Components and Packaging Technologies, 24, 24–32, 2001.CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  1. 1.School of Materials Science and EngineeringGeorgia Institute of TechnologyAtlantaUSA
  2. 2.Henkel Loctite (China) Co. Ltd.ChandlerPeople’s Republic China

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