Future Trend of Conductive Adhesive Technology

  • Yi LiEmail author
  • Daniel Lu
  • C. P. Wong


As can be seen from previous chapters, tremendous progress has been made to improve the conductive adhesive technology for ICAs, ACA, and NCA.


Contact Resistance Silver Flake Organic Electronic Device High Filler Loading Copper Filler 
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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  1. 1.School of Materials Science and EngineeringGeorgia Institute of TechnologyAtlantaUSA
  2. 2.Henkel Loctite (China) Co. Ltd.ChandlerPeople’s Republic China

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