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Conductive Nano-Inks

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Electrical Conductive Adhesives with Nanotechnologies

Abstract

Patterning of electronics to obtain specific designs is conventionally carried out on wafer or substrates by photolithography. This is a process to transfer images and patterns from a mask to the surface of a wafer or substrate. The steps typically involved in the photolithographic process are wafer or substrate cleaning, barrier layer formation, photoresist application, soft baking, mask alignment, exposure and development, and hard-baking.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, 30332-0245, Atlanta, GA, USA

    Yi Li & C. P. Wong (Prof)

  2. Henkel Loctite (China) Co. Ltd., 5000 W. Chandler Blvd, 264006, Chandler, People’s Republic China

    Daniel Lu

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  1. Yi Li
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  2. Daniel Lu
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  3. C. P. Wong
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Correspondence to Yi Li .

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Li, Y., Lu, D., Wong, C.P. (2010). Conductive Nano-Inks. In: Electrical Conductive Adhesives with Nanotechnologies. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-88783-8_7

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  • DOI: https://doi.org/10.1007/978-0-387-88783-8_7

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