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Non-Conductive Adhesives/Films (NCA/NCF)

  • Yi Li
  • Daniel Lu
  • C. P. Wong
Chapter

Abstract

Electrically conductive adhesive joints can be formed using unfilled organic adhesives, i.e., without any conductive filler particles. The electrical connection of non-conductive adhesives/films (NCA/NCF) is achieved by sealing the two contact partners under pressure and heat. Thus, the small gap contact is created, approaching the two surfaces to the distance of the surface asperities. The formation of contact spots depends on the surface roughness of the contact partners [1-5]. Approaching the two surfaces enables a small number of contact spots to form which allows the electric current to flow. When the parts are pressed together during the sealing process, the number and area of the single contact spots are increased according to the macroscopic elasticity or flexibility of the parts and the microhardness and plasticity of the surfaces, respectively.

Keywords

Contact Resistance Conductive Filler Anisotropic Conductive Film Flip Chip Bonding Pressure 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  1. 1.School of Materials Science and EngineeringGeorgia Institute of TechnologyAtlantaUSA
  2. 2.Henkel Loctite (China) Co. Ltd.ChandlerPeople’s Republic China

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