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Characterizations of Electrically Conductive Adhesives

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Electrical Conductive Adhesives with Nanotechnologies

Abstract

Organic polymers are widely used as structural materials and as processing aids in the electronics industry. The widespread use of polymeric materials in electronics is due to the ease in which desired engineering properties can be designed into materials by the manipulation of polymer structures and formulary compositions. In addition, the wide range of fabrication processes by which polymers can be formed into finished articles and the lower fabrication costs of polymers compared to metals or ceramics have contributed to ubiquitous use of polymers in electronic assemblies. Electronic packaging makes use of a wide variety of polymer material classes to fulfill a diverse range of engineering uses such as adhesives, substrates (printed circuit boards), encapsulants, stress buffer coatings, and interlayer dielectrics.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, 30332-0245, Atlanta, GA, USA

    Yi Li & C. P. Wong

  2. Henkel Loctite (China) Co. Ltd., 5000 W. Chandler Blvd, 264006, Chandler, People’s Republic China

    Daniel Lu

Authors
  1. Yi Li
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  2. Daniel Lu
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  3. C. P. Wong
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Correspondence to Yi Li .

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Li, Y., Lu, D., Wong, C.P. (2010). Characterizations of Electrically Conductive Adhesives. In: Electrical Conductive Adhesives with Nanotechnologies. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-88783-8_3

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  • DOI: https://doi.org/10.1007/978-0-387-88783-8_3

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