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Characterizations of Electrically Conductive Adhesives

  • Yi Li
  • Daniel Lu
  • C. P. Wong
Chapter

Abstract

Organic polymers are widely used as structural materials and as processing aids in the electronics industry. The widespread use of polymeric materials in electronics is due to the ease in which desired engineering properties can be designed into materials by the manipulation of polymer structures and formulary compositions. In addition, the wide range of fabrication processes by which polymers can be formed into finished articles and the lower fabrication costs of polymers compared to metals or ceramics have contributed to ubiquitous use of polymers in electronic assemblies. Electronic packaging makes use of a wide variety of polymer material classes to fulfill a diverse range of engineering uses such as adhesives, substrates (printed circuit boards), encapsulants, stress buffer coatings, and interlayer dielectrics.

Keywords

Differential Scanning Calorimetry Conductive Filler Conductive Adhesive Cyanate Ester Diffuse Reflectance Infrared Fourier Transform Spectroscopy 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  1. 1.School of Materials Science and EngineeringGeorgia Institute of TechnologyAtlantaUSA
  2. 2.Henkel Loctite (China) Co. Ltd.ChandlerPeople’s Republic China

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