Integrated circuits (ICs) form the bases of all modern electronic products. However, an IC alone does not form a complete system and it must be integrated with other components into a system-level board. “Electronic Packaging” is defined as the bridge that interconnects the integrated circuits (ICs) and other components into a system-level board to form electronic products [1]. The packaging has four main functions: (1) signal distribution, mainly involving topological and electromagnetic considerations; (2) power distribution, involving electromagnetic, structural, and material aspects; (3) heat dissipation (thermal management), involving structural and material considerations; (4) and protection (mechanical, chemical, electromagnetic) of components and interconnections.


Solder Alloy Composite Solder Conductive Filler Ball Grid Array Conductive Adhesive 


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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  1. 1.School of Materials Science and EngineeringGeorgia Institute of TechnologyAtlantaUSA
  2. 2.Henkel Loctite (China) Co. Ltd.ChandlerPeople’s Republic China

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