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Introduction

  • Yi Li
  • Daniel Lu
  • C. P. Wong
Chapter

Abstract

Integrated circuits (ICs) form the bases of all modern electronic products. However, an IC alone does not form a complete system and it must be integrated with other components into a system-level board. “Electronic Packaging” is defined as the bridge that interconnects the integrated circuits (ICs) and other components into a system-level board to form electronic products [1]. The packaging has four main functions: (1) signal distribution, mainly involving topological and electromagnetic considerations; (2) power distribution, involving electromagnetic, structural, and material aspects; (3) heat dissipation (thermal management), involving structural and material considerations; (4) and protection (mechanical, chemical, electromagnetic) of components and interconnections.

Keywords

Solder Alloy Composite Solder Conductive Filler Ball Grid Array Conductive Adhesive 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2010

Authors and Affiliations

  1. 1.School of Materials Science and EngineeringGeorgia Institute of TechnologyAtlantaUSA
  2. 2.Henkel Loctite (China) Co. Ltd.ChandlerPeople’s Republic China

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