Compaction-Induced Deformation on Flexible Substrate

  • B. Punantapong
Conference paper
Part of the Lecture Notes in Electrical Engineering book series (LNEE, volume 28)


This paper describes the analytical method for evaluation of compaction-induced stresses and deformation on the thin layer of flexible substrate by using finite element analysis. The incremental placement and compaction of the thin layer of flexible substrate are based on a hysteretic model for residual stresses induced by multiple cycles of loading and unloading. The results showed that the large compaction load can be applied to a thin layer of flexible substrate and it achieves higher density effectively. The reinforcement of the layer also increases compaction efficiency, because it reduces the ratio between shear and vertical forces during the compaction process. The maximum vertical stress on the base of specimen usually decreased with higher compaction thickness. The reinforcement will acheive increased substrate stiffness under the compaction indenter and it initiates stress concentration. As a result, it maintains a higher vertical stress level on the base of the specimen that provides better compaction characteristics. Therefore, it can be concluded that the reinforcement is essential for achieving effective compaction on the thin layer of flexible substrate.


Vertical Stress Flexible Substrate Substrate Layer Periodic Loading Layer Stiffness 
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Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  • B. Punantapong
    • 1
  1. 1.Department of Industrial Physics and Medical Instrumentation, King Mongkut’s Institute of Technology North BangkokBiomaterials and Nanotechnology Research UnitBangsueThailand

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