With wide applications of thin films in microelectronic devices, microelectromechanical systems (MEMS), and nanoelectromechanical systems (NEMS), thin films have attracted great interest from academics and industrialists. In general, thin films have different mechanical properties from their bulk counterparts [3, 16, 23]. The mechanical properties of a thin film, such as its Young’s modulus and residual stress, are essential and necessary input information for detailed design and analysis of MEMS and NEMS devices. Mechanical characterization of thin films has in fact become one of the most important challenges in the development of micro/nanotechnologies and a very active area of research, as illustrated by the fact that the US Materials Research Society has organized 11 symposiums on the subject since 1988. The major difficulty encountered in the mechanical characterization of thin films is that they are not amenable to testing by conventional means because of their...
KeywordsResidual Stress Resultant Force Multilayer Film Deflection Curve Multilayer Thin Film
This work was supported by an RGC grant from the Hong Kong Research Grants Council, Hong Kong Special Administrative Region, China. The author thanks Professor MH Zhao, Professor CF Qian, Professor JR Li, and Dr. J Wang for their help in the theoretical analysis and in the calculation of the spring compliances. The author is also grateful to Professor YJ Su, Dr. LQ Chen, Dr. WH Xu, Dr. XS Wang, and Dr. B Huang for their experimental work. The experiments were conducted at the Microelectronics Fabrication Facility and the Design and Manufacturing Services Facility, HKUST.
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