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Materials, Structures and Packaging

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Multi-Wafer Rotating MEMS Machines

Part of the book series: MEMS Reference Shelf ((MEMSRS))

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Abstract

Realization of the Microengine and related devices is dependent on achieving four key requirements: 1. High peak cycle temperatures (1600–2500 K) 2. High peripheral speeds (400–600 m/s) 3. Effective bearings (air bearings for the microengine) 4. Reasonable individual component efficiencies.

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References

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Acknowledgments

The author would like to acknowledge all those who contributed to the Materials, Structures and Packaging tasks on the Microengine and related projects, including: Lallit Anand, Arturo Ayon, Shaun Berry, Kuo-Shen Chen, Dongwon Choi, Todd Harrison, Eugene Huang, Adam London, Hangqing Li, Kevin Lohner, Norihisa Miki, Bruno Miller, Hyung-Soo Moon, Anna Mracek, Erin Noonan, Yoav Peles, Christopher Protz, Dong-Jin Shim, Robert Shinavski, Christopher Spaddaccini, Hongwei Sun, Kevin Turner, Srikar Vengallatore, Douglas Walters, Wenjing Ye and Xin Zhang. SMS also is very grateful for the highly effective and rewarding collaborations across the whole Microengine project and for the various funding sources that made it all possible. He is especially thankful for the leadership and vision provided by Prof. Alan Epstein.

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Authors and Affiliations

  1. School of Engineering Sciences, University of Southampton, University Road, SO17 1BJ, Southampton, UK

    S. Mark Spearing

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  1. S. Mark Spearing
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Correspondence to S. Mark Spearing .

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Editors and Affiliations

  1. Dept. Electrical Engineering &, Massachusetts Institute of Technology, Massachusetts Ave. 77, Cambridge, 02139-4307, U.S.A.

    Jeffrey Lang

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Spearing, S.M. (2009). Materials, Structures and Packaging. In: Lang, J. (eds) Multi-Wafer Rotating MEMS Machines. MEMS Reference Shelf. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-77747-4_3

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  • DOI: https://doi.org/10.1007/978-0-387-77747-4_3

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  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-77746-7

  • Online ISBN: 978-0-387-77747-4

  • eBook Packages: EngineeringEngineering (R0)

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