A DFA Framework for Hybrid Microsystems
This paper presents a framework for Design For Assembly of hybrid microsystems. Hybrid microsystems are microsystems, mainly semi-conductor based, which offer diverse functionality, and which are realised by integrating elements (die, parts) from different material and technology domains. From macro-domain mechanical products, it is known that the design of these products is of major importance for the performance of the assembly process. The paper addresses the question which aspects of assembly-oriented design are relevant for hybrid microsystems. A Design For Assembly (DFA) framework is presented, which distinguishes two main levels of design decisions: the integration approach level and the process and technology level. The framework is illustrated on the basis of a product case: an optode for medical applications.
KeywordsAssembly Process Technology Level Wire Bond Glass Wafer Lead Chip
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