Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array
In this article a versatile packaging solution is presented that allows the static and active alignment of a microlens array that is to be placed over a microUV-LED array. A modified UV-LIGA process is applied for building up the structure. For the static approach, the microlens array rests on four posts with the aim of reducing the contact area between the two parts, hence reducing the probability of vertical misalignment. The fine height adjustment is done by electroplating a certain thickness to the electrodes where the posts are being placed. Since the electrodes can be individually addressed, a possible tilt, caused by uneven post heights, can be compensated. With minimal modifications, the structure can be rendered into a dynamic alignment system, featuring actuators for vertical and lateral movement. Even though the microlens array is part of the actuator itself, it is not connected to any potential or energy sources. A magnetic actuator is proposed and partly tested that is capable of simultaneously perform a lateral movement while the vertical actuation is in progress. As a restoring means, a gel material is used as a precursor for a photo-patternable PDMS structure.
KeywordsTime Slot Lateral Movement Step Response Microlens Array Electrostatic Actuation
- C. Pusarla and A. Christou, “Solder bonding alignment of microlens in hybrid receiver for free space optical interconnections,” presented at Electronic Components and Technology Conference, 1996. Proceedings., 46th, 1996.Google Scholar
- S. S. Lee, L. Y. Lin, K. S. J. Pister, M. C. Wu, H. C. Lee, and P. Grodzinski, “Passively aligned hybrid integration of 8 × 1 micromachined micro-Fresnel lens arrays and 8 × 1 vertical-cavity surface-emitting laser arrays for free-space optical interconnect,” IEEE Photonics Technology Letters, vol. 7, pp. 1031–1033, 1995.CrossRefGoogle Scholar
- G. C. Boisset, B. Robertson, W. S. Hsiao, M. R. Taghizadeh, J. Simmons, K. Song, M. Matin, D. A. Thompson, and D. V. Plant, “On-die diffractive alignment structures for packaging of microlens arrays with 2-D optoelectronic device arrays,” Photonics Technology Letters, IEEE, vol. 8, pp. 918–920, 1996.CrossRefGoogle Scholar
- M. S. Cohen, M. J. DeFranza, F. J. Canora, M. F. Cina, R. A. Rand, and P. D. Hoh, “Improvements in index alignment method for laser-fiber array packaging,” IEEE Transactions on Components, Packaging, and Manufacturing Technology Part B: Advanced Packaging, vol. 17, pp. 402–411, 1994.CrossRefGoogle Scholar
- S. J. Woo, J. U. Jeon, T. Higuchi, and J. Jin, “Electrostatic force analysis of electrostatic levitation system,” Hokkaido, Jpn, 1995.Google Scholar