Through-Silicon Via Fabrication, Backgrind, and Handle Wafer Technologies

  • Sharath Hosali
  • Greg Smith
  • Larry Smith
  • Susan Vitkavage
  • Sitaram Arkalgud
Part of the Integrated Circuits and Systems book series (ICIR)


Etch Rate Atomic Layer Deposition Seed Layer Physical Vapor Deposition Bond Layer 
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Copyright information

© Springer Science+Business Media, LLC 2008

Authors and Affiliations

  • Sharath Hosali
    • 1
  • Greg Smith
  • Larry Smith
  • Susan Vitkavage
  • Sitaram Arkalgud
  1. 1.SEMATECHAustinUSA

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