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Monolithic 3D Integrated Circuits

  • Christopher Petti
  • S. Brad Herner
  • Andrew Walker
Chapter
Part of the Integrated Circuits and Systems book series (ICIR)

Introduction

Monolithic three-dimensional integrated circuits (3D ICs) – defined here to be ICs in which circuit elements are fabricated on a substrate, and at least one layer above this substrate, in a single linear process flow with no material bonding required – were first touted in the literature in the early 1980s as a way to get around what were then perceived as scaling limits in silicon complementary metal-oxide semiconductor (CMOS) devices. Moreover, monolithic 3D ICs were envisioned as one way to reduce interconnect delay bottlenecks in 2D ICs [1].

However, conventional 2D CMOS devices have consistently been scaled beyond all these perceived limits; thus, simply scaling CMOS circuits has been more cost-effective than building-in the third dimension. There have been exceptions: polyload static random access memories (SRAMs), for example, where the elements placed in the third dimension are as simple (and as cheaply made) as possible.

Recently, the amount of interest in...

Keywords

Laser Annealing Static Random Access Memory NAND Flash CMOS Inverter Tunnel Oxide 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2008

Authors and Affiliations

  • Christopher Petti
    • 1
  • S. Brad Herner
  • Andrew Walker
  1. 1.SanDisk CorporationMilpitasUSA

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