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Status and Outlook

  • Scott K. Pozder
  • Robert E. Jones
Chapter
Part of the Integrated Circuits and Systems book series (ICIR)

Introduction

The preceding chapters have described a wide range of three-dimensional (3D) integration technologies. There has been a very substantial level of research and development (R&D) effort underway in universities and industry. As is typical of an immature technology, there has not yet been much consolidation of the technology choices. There is also a wide range of various types of applications where 3D integration may be advantageous. While there has been limited productization of 3D integration to date, in general, there has not yet been widespread implementation. However, 3D integration appears poised to become a significant player in the market in the next few years.

In this chapter, we will look at the structure of the technology application landscape and discuss the status and challenges of various technologies to meet these requirements. We will also consider the additional challenges that 3D integration can bring to packaging. The role of economics in determining...

Keywords

Alignment Accuracy Heterogeneous Integration Overlay Accuracy Digital Logic Circuit Additional Semiconductor 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2008

Authors and Affiliations

  • Scott K. Pozder
    • 1
  • Robert E. Jones
  1. 1.Freescale Semiconductor, Inc.AustinUSA

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