Circuit Architectures for 3D Integration

Part of the Integrated Circuits and Systems book series (ICIR)


Solder Bump Device Layer Readout Circuit Pass Transistor Heterogeneous Technology 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer Science+Business Media, LLC 2008

Authors and Affiliations

  1. 1.Lincoln LaboratoryMassachusetts Institute of TechnologyLexingtonUSA

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