A Built-In Self-Test and Diagnosis Strategy for Chemically-Assembled Electronic Nanotechnology

  • J. G. Brown
  • R. D. (Shawn) Blanton
Part of the Frontiers in Electronic Testing book series (FRET, volume 37)

Very recently, researchers have achieved revolutionary advances that may radically change the future of computing. By controlling the transfer of energy between molecules, molecular-scale structures can be used to perform computational tasks. As we approach the economic and physical limits of current solid-state electronics, traditional semiconductor devices become increasingly difficult to manufacture. Advances in physics, chemistry, and biology have exposed new research opportunities for “bottom-up” fabrication techniques [1–8]. These bottom-up techniques are referred to as chemical self-assembly. Unlike photolithographic and etch techniques used in CMOS technologies, bottom-up fabrication techniques rely on molecules assembling themselves into regular patterns to create a computing system. Molecular electronics will not only address the ultimate limits of miniaturization but also provide promising methods for novel manufacturing techniques.


Defect Tolerance Defect Density Test Pattern Average Recovery Output Line 
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© Springer Science+Business Media, LLC 2008

Authors and Affiliations

  • J. G. Brown
  • R. D. (Shawn) Blanton

There are no affiliations available

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