Assembly- and Packaging Methods
In the context of IC processing the term die assembly is used for the mechanical attachment of the die to the substrate, and the thermal binding of the circuit to the substrate. With power semiconductors the electrical connection gains special importance. During assembly (pick and place) the die is picked up with a vacuum pipette first, then aligned if necessary, and then placed accurately on the substrate. In the simplest case the pick and place device can be a semi-automaton, manually steered for position and movement. For the assembly of larger die numbers fully automatic machines are used. In mass production the sawed dies are arranged on a self-adhesive stretched foil (blue tape) suspended on a frame by which they are supplied directly to the subsequent treatment by the automaton. With small numbers of dies and in manual assembly the dies can be kept in a waffle pack (tray).
KeywordsPrint Circuit Board Gold Wire Peel Test Metal Package Pull Test
Unable to display preview. Download preview PDF.
- [23.1]Hanke, H. J. (Editor): ‘Baugruppentechnologie der Elektronik-Hybridträger’. – Berlin: Verlag Technik, 1994Google Scholar
- [23.2]Scheel, W. (Editor): ‘Baugruppentechnologie der Elektronik-Montage’.–Berlin: Verlag Technik, 1997Google Scholar
- [23.3]Reichl, H. (Editor): ‘Hybridintegration’.–Heidelberg: Huethig Verlag, 1988Google Scholar
- [23.4]‘Test Methods and Procedures for Microelectronics’. MIL-STD 883 C. Department of Defense, USA, 1983Google Scholar