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The impedance characteristics of a power distribution system are analyzed in the previous chapter based on a one-dimensional circuit model. While useful for understanding the principles of the overall operation of a power distribution system, a one-dimensional model is not useful in describing the distribution of power and ground across a circuit die. The size of an integrated circuit is usually considerably greater than the wavelength of the signals in the power distribution network. Furthermore, the power consumption of on-chip circuitry (and, consequently, the current drawn from the power distribution network) varies across the die area. The voltage across the on-chip power and ground distribution networks is therefore non-uniform. It is therefore necessary to consider the two-dimensional structure of the on-chip power distribution network to ensure that target performance characteristics of a power distribution system are satisfied. The on-chip power distribution network should also be considered in the context of a die-package system as the properties of the die-package interface significantly affect the constraints imposed on the electrical characteristics of the on-chip power distribution network.

The objectives of this chapter is to describe the structure of an on-chip power distribution network as well as review related tradeoffs. Various structural styles of on-chip power distribution networks are described in Section 7.1. The influence of the electrical characteristics of the die-package interface on the on-chip power and ground distribution is analyzed in Section 7.2. The influence of the on-chip power distribution network on the integrity of the on-chip signals is discussed in Section 7.3. The chapter concludes with a summary.

Keywords

Metal Layer Power Distribution Ground Line Circuit Block Power Distribution System 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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© Springer Science + Business Media, LLC 2008

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