Printed wiring board manufacturing yields and subsequent product reliability are significantly impacted by the properties and characteristics of the laminate materials used. The selection of laminate materials is more critical for achieving higher temperature lead-free solder alloy assembly yield targets and long term product reliability requirements. The SAC305 tin-silvercopper alloy (3.0 percent silver and 0.5 percent copper) recommended for lead-free assembly reflow processing and rework has a melting point about 40°C higher than the melting point of eutectic tin-lead.
KeywordsPeel Strength Laminate Material Thermal Cycling Test Product Reliability Print Wiring Board
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