PCB Laminates

  • Karl Sauter Sr

Printed wiring board manufacturing yields and subsequent product reliability are significantly impacted by the properties and characteristics of the laminate materials used. The selection of laminate materials is more critical for achieving higher temperature lead-free solder alloy assembly yield targets and long term product reliability requirements. The SAC305 tin-silvercopper alloy (3.0 percent silver and 0.5 percent copper) recommended for lead-free assembly reflow processing and rework has a melting point about 40°C higher than the melting point of eutectic tin-lead.


Peel Strength Laminate Material Thermal Cycling Test Product Reliability Print Wiring Board 
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  1. 1.
    Baggio T, Suetsugu K (1999) Guidelines for Lead-Free Processing, SMT magazineGoogle Scholar
  2. 2.
    Davignon J, Reed R (2000) Effects of NEMI Sn/Ag/Cu Alloy Assembly Reflow on Plated Through Hole Performance, NEPCON East Conference, Boston, USAGoogle Scholar
  3. 3.
    Smetana J (2002) Plated Through Hole Reliability with High Temperature Lead-Free Soldering, The Board Authority magazineGoogle Scholar
  4. 4.
    Leys D, Schaefer S (2003) PWB Dielectric Substrates for Lead-Free Electronics Manufacturing, CircuiTree magazineGoogle Scholar
  5. 5.
    Turbini L, Bent W, Ready W, Impact of Higher Melting Lead-Free Solders on the Reliability of Printed Wiring Assemblies, Center for Microelectronics Assembly and Packaging, University of Toronto, Toronto, Canada, and Georgia Institute of Technology, Atlanta, USAGoogle Scholar
  6. 6.
    Engelmaier W (2003) Reliability of Lead-Free Solder Joints Revisited, Global SMT & Packaging, p. 34Google Scholar
  7. 7.
    Wolf D (2003) Delphi Reliability Study, IPC PCQR2/CATGoogle Scholar
  8. 8.
    Smetana J (2006) Via (PTH) Integrity with Lead Free Soldering, IPC PC EXPO-APEX conference, Anaheim, USA, S24;

Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  • Karl Sauter Sr
    • 1
  1. 1.Semiconductor Packaging & PCB TechnologySun Microsystems, Inc.Santa ClaraUSA

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