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Backward and Forward Compatibility

  • Jianbiao Pan
  • Jasbir Bath
  • Xiang Zhou
  • Dennis Willie

In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’ impending lead-free directives, the electronics industry is moving toward lead-free soldering. Total lead-free soldering requires not only lead-free solder paste but also lead-free printed circuit board (PCB) finish and lead-free component/packages. Transitioning tin-lead (SnPb) soldering to totally lead-free soldering is a complex issue and involves movement of the whole electronics industry supply chain. In reality, there is a transition period.

Keywords

Solder Joint Print Circuit Board Solder Ball Electroless Nickel Immersion Gold Organic Solderability Preservative 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  • Jianbiao Pan
    • 1
  • Jasbir Bath
    • 2
  • Xiang Zhou
    • 2
  • Dennis Willie
    • 2
  1. 1.San Luis ObispoUSA
  2. 2.Solectron CorporationMilpitasUSA

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