In response to the European Union (EU) Restriction of Hazardous Substances (RoHS) and other countries’ impending lead-free directives, the electronics industry is moving toward lead-free soldering. Total lead-free soldering requires not only lead-free solder paste but also lead-free printed circuit board (PCB) finish and lead-free component/packages. Transitioning tin-lead (SnPb) soldering to totally lead-free soldering is a complex issue and involves movement of the whole electronics industry supply chain. In reality, there is a transition period.
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Pan, J., Bath, J., Zhou, X., Willie, D. (2007). Backward and Forward Compatibility. In: Bath, J. (eds) Lead-Free Soldering. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-68422-2_7
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