Precision manufacturing processes are defined here as those for which there is a very small amount of material removed (per cutting edge, for example) and for which the surface or feature created can be characterized by stringent tolerances on form, dimension or surface characteristics. We will emphasize here processes with very small chip thickness, acav, as defined below as well as processes for which no discernible “chip” is produced but features are created never-the-less. These processes include abrasive machining (including lapping, polishing and honing) and can be characterized by either two body or three body abrasive interactions. The nontraditional processes include those Taniguchi referred to as “ultrahigh precision machining” such as atomic bit processing with electron beams or electrolytic polishing, photon sputtering or electric field “removing” or evaporation such as AFM and STM processing.
KeywordsMaterial Removal Material Removal Rate Chip Thickness Abrasive Particle Uncut Chip Thickness
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