Abstract
The present volume is devoted to the issues of modeling and numerical simulations in electrochemistry. With the continuing development of more and more powerful computer hardware and software systems, the nature of modeling keeps evolving and expanding. Workers in industry and academia keep developing, testing, and understanding and producing new products. Those in most cases require new materials which benefit from modeling as it obviates the need to actually try every possible new material. Indeed, owing to the growth in the development of material science and technology, the requirements for high-quality, reliable materials have become more stringent. That is so especially in the nano 3D space industries. It is more often than not difficult for conventional materials to completely meet those new more stringent requirements. In this case, closer study of nanostructured materials is often called for. However, such study/search is not possible if no data for securing reliability and safety of the nanostructured materials can be assured.
Keywords
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
J. R. Greer, W. C. Oliver, and W. D. Nix, Acta Mater 53 (2005), 1821.
Y. Isono, T. Namazu, and N. Terayama, J Microelectromech Syst 15(1) (2006), 169.
J.-W. Lee, J.-C. Huang, and J.-G. Duh, Tamkang J Sci Eng 7(4) (2004), 237.
C. Thomsen, H. T. Grahn, H. J. Maris, and J. Tauc., Phys Rev B 34 (1986), 4129.
H. T. Grahn, H. J. Maris, J. Tauc, and B. Abeles, Phys Rev B 38 (1988), 6066.
O. B. Wright and K. Kawashima, Phys Rev Lett 69 (1992), 1668.
H.-N. Lin, H. J. Maris, and L. B. Freund, J Appl Phys 73(1) (1992), 37.
B. Bonello, B. Perrin, and C. Rossignol, J Appl Phys 83(6) (1998), 3081.
K. Yamanaka, H. Ogiso, and O. Kolosov, Appl Phys Lett 64(2) (1994), 178.
K. Yamanaka and S. Nakano, Jpn J Appl Phys 35(5) (1996), 3787.
G. Binnig, C. F. Quate, and Ch. Gerber, Phys Rev Lett 56(1986), 930.
K. Yamanaka, S. Nakano, and H. Ogiso, International Symposium on Measurement Technology and Intelligent Instruments (1996), 451.
S. Amerio, A. V. Goldade, U. Rabe, V. Scherer, B. Bhusan, and W. Arnold, Thin Solid Films 392(2001), 75.
B. Gauitier and V. Bornand, Thin Solid Films 515 (2006), 1592.
A. Atalar, C. F. Quate, and H. K. Wickramasinge, Appl Phys Lett 31 (1977), 791.
R. D. Weglein, IEEE Trans Sonics SU27(2) (1980), 82.
R. C. Bray, C. F. Quate, J. Calhoun, and R. Kock, Thin Solid Films 74 (1980), 295.
R. D. Weglein, Electron Lett 18(22) (1982), 1003.
C. C. Lee, C. S. Tsai, and X. Cheng, IEEE Trans Sonics Ultrasonics SU-32(2)(1985), 248.
J. Kushibiki and N. Chubachi, Electron Lett 23(12)(1987), 652.
R. C. Addison, M. C. Somekh, J. M. Rowe, and G. A. D. Briggs, SPIE 768 Pattern recognition and acoustical imaging (ed. L. A. Ferrari) (1987), 275.
J. Kushibiki, T. Ishikawa, and N. Chubachi, Appl Phys Lett 57(19) (1990), 1967.
R. D. Weglein and A. K. Mal, Surf Coat Technol 47 (1991), 667.
A. Okada, C. Miyasaka, and T. Nomura, JIM 33(1) (1992), 73.
T. Kundu, J Appl Mech 59 (1992), 54.
Y. Sasaki, T. Endo, T. Yamagishi, and M. Sakai, IEEE Trans UFFC-39(5) (1992), 638.
T. Endo, C. Abe, M. Sakai, and M. Ohono, Proceedings Ultrasonic International 93 Conference (1993), 45.
D. Achenbach, J. D. Kim, and Y. C. Lee, Advances in Acoustic Microscopy, vol. 1, Plenum, New York, (1995), 153.
S. Parthasarathi, B. R. Tittmann, and R. J. Ianno, Thin Solid Films 300 (1997), 42.
A. Doghmane, Z. Hadjoub, and F. Hadjoub, Thin Solid Films 310 (1997), 203.
D. Rats, J. von Stebut, and F. Augereau, Thin Solid Films 355–356 (1999), 347.
Z. Guo, J. D. Achenbach, A. Madan, K. Martin, and M. E. Graham, Thin Solid Films 394 (2001), 189.
M. J. Bamber, K. E. Cooke, A. B. Mann, and B. Derby, Thin Solid Films 398–399 (2001), 299.
F. Zhang, S. Krishnaswarmy, D. Fei, D. A. Rebinsky, and B. Feng, Thin Solid Films 503 (2006), 250.
B. Hadimioglu and C. F. Quate, Appl Phys Lett 43 (1983), 1006.
K. Karaki and M. Sakai, Ultrasonic Technology 1987, Toyohashi International Conference on Ultrasonic Technology, Toyohashi, Japan, MYU Research, Tokyo (1987), 25.
K. Yamanaka, Y. Nagata, and T. Koda, Ultrasonics Int 89 (1989), 744.
Foster and D. Rugar, Appl Phys Lett 42 (1983), 869.
M. S. Muha, A. A. Moulthrop, G. C. Kozlowski, and B. Hadimioglu, Appl Phys Lett 56 (1990), 1019.
N. Chubachi, J. Kushibiki, T. Sannomia, and Y. Iyama, Proc IEEE Ultrasonics Symp (1979), 415.
D. A. Davids, P. Y. We, and D. Chizhik, Appl Phys Lett 54(17) (1989), 1639.
A. Atalar, H. Koymen, and L.Degertekin, Proc IEEE Ultrasonics Symp (1990), 359.
B. T. Khuri-Yakub, C. Cinbis, and P. A. Reinholdtsen, Proc IEEE Ultrasonics Symp (1989), 805.
C. Miyasaka, B. R. Tittmann, and M. Ohno, Res Nondestr Eval 11(1999), 97.
R. D. Weglein, Appl Phys Lett 34 (1979), 179.
W. Parmon and H. L. Bertoni, Electron Lett 15 (1979), 684.
A. Atalar, J Appl Phys 49 (1978), 5130.
K. Liang, G. S. Kino, and B. T. Khuri-Yakub, IEEE Trans SU-32 (1985), 213.
T. Endo, Y. Sasaki, T. Yamagishi, and M. Sakai, Jpn Appl Phys 31 (1992), 160.
J. Kushibiki, K. Horii, and N. Chubachi, Electron Lett 19 (1983), 404.
J. Kushibiki, T. Kobayashi, H. Ishiji, and N. Chubachi, Appl Phys Lett 61(18) (1992), 2164.
J. Kushibiki, M. Miyashita, and N. Chubachi, IEEE Photonics Technol Lett 8(11) (1996), 1516.
J. Kushibiki and M. Miyashita, Jpn J Appl Phys 36(7B) (1997), 959.
J. Kushibiki and N. Chubachi, IEEE Trans Sonics Ultrasonics SU-32(2) (1985), 189.
Z. L. Li, IEEE Trans UFCC-40(6) (1993), 680.
J. Kushibiki and M. Arakawa, IEEE Trans UFCC-45(2) (1998), 421.
K. Yamanaka and Y. Enomoto, J Appl Phys 53(1982), 846.
C. Iett, M. G. Somekh, and G. A. D. Briggs, Proc R Soc Lond A393 (1984), 171.
G. A. D. Briggs, P. J. Jenkins, and M. Hoppe, “How fine a surface crack can you see in a scanning acoustic microscope?,” J Microsc 159 (1990), 15–32.
M. Ohono, C. Miyasaka, and B. R. Tittmann, “Pupli function splitting method in calculating acoustic microscopic signals for elastic discontinuities,” J Wave Motion Sound 33 (2001), 309–320.
C. Miyasaka, B. R. Tittmann, and S. Tanaka, “Characterization of stress at a ceramic/metal joint interface by the V(z) technique of scanning acoustic microscopy,” J Pressure Vessel Technol 124(3) (2002), 336.
C. Miyasaka, B. R. Tittmann, and S. Tanaka, Nondestr Test Eval 18 (2002), 131.
Acknowledgements
C.M. thanks M. Schlesinger for his useful advice, and E. Buakulin for developing the simulation software.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2009 Springer Science+Business Media, LLC
About this chapter
Cite this chapter
Miyasaka, C. (2009). Acoustic Microscopy Applied to NanoStructured Thin Film Systems. In: Schlesinger, M. (eds) Modern Aspects of Electrochemistry No. 44. Modern Aspects of Electrochemistry, vol 44. Springer, New York, NY. https://doi.org/10.1007/978-0-387-49586-6_9
Download citation
DOI: https://doi.org/10.1007/978-0-387-49586-6_9
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-0-387-49584-2
Online ISBN: 978-0-387-49586-6
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)