Skip to main content
SpringerLink
Log in
Book cover

Lead-Free Electronic Solders pp 175–189Cite as

Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

  • Chapter
  • First Online:

Abstract

The mechanical properties of Sn-rich solder alloys are directly related to their heterogeneous microstructure. Thus, numerical modeling of the properties of these alloys is most effective when the microstructure is explicitly incorporated into the model. In this review, we provide several examples where 2D and 3D microstructures have been used to model the material behavior using finite element modeling. These included (a) 3D visualization of the solder microstructure, (b) 3D microstructure-based modeling of tensile behavior, (c) 2D modeling of the effect of intermetallic volume fraction and morphology on shear behavior of solder joints, and (d) prediction of crack growth in solder joints. In all these cases, the experimentally observed behavior matches very well with the microstructure-based models.

This is a preview of subscription content, log in via an institution.

Chapter
USD   29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD   169.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD   219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD   219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. S. Kang, A.K. Sarkhel, J. Electron. Mater. 23, 701 (1994)

    Google Scholar 

  2. D.R. Frear, P.T. Vianco, Metall. Mater. Trans. A 25, 1509 (1994)

    Google Scholar 

  3. J. Glazer, Inter. Mater. Rev. 40, 65 (1995)

    Google Scholar 

  4. W.J. Plumbridge, C.R. Gagg, Proc. Inst. Mech. Engrs. L, J. Mater.: Des Appl. 214, 153 (2000)

    Google Scholar 

  5. M. Kerr, N. Chawla, Acta Mater. 52, 4527 (2004)

    Article  Google Scholar 

  6. F. Ochoa, J.J. Williams, N. Chawla, J. Electron. Mater. 32, 1414 (2003)

    Article  Google Scholar 

  7. F. Ochoa, J.J. Williams, N. Chawla, JOM 55, 56 (2003)

    Article  Google Scholar 

  8. R.J. McCabe, M.E. Fine, Scripta Mater. 39, 189 (1998)

    Article  Google Scholar 

  9. H. Rhee, J.P. Lucas, K.N. Subramanian, J. Mater. Sci. 13, 477 (2002)

    Article  Google Scholar 

  10. C. Basaran, J. Jiang, Mech. Mater. 34, 349 (2002)

    Article  Google Scholar 

  11. N. Chawla, F. Ochoa, S. Scaritt, M. Koopman, K.K. Chawla, V.V. Ganesh, X. Deng, J. Mater. Sci.: Mater. Electron. 15, 385 (2004)

    Article  Google Scholar 

  12. N. Ramakrishna, V.S. Arunachalam, J. Am. Ceram. Soc. 76, 2745 (1993)

    Article  Google Scholar 

  13. W.M. Sherry, J.S. Erich, M.K. Bartschat, F.B. Prinz, IEEE Trans. Comp., Hybrids Manuf. Tech. 8, 417 (1985)

    Article  Google Scholar 

  14. D.G. Kim, H.S. Jang, J.W. Kim, S.B. Jung, J. Mater. Sci.: Mater. Elec. 16, 603 (2005)

    Article  Google Scholar 

  15. S. Ling, A. Dasgupta, Trans. ASME 118, 72 (1996)

    Google Scholar 

  16. D.G. Kim, J.W. Kim, S.B. Jung, Microelec. Eng. 82, 575 (2005)

    Article  Google Scholar 

  17. J.W. Kim, D.G. Kim, S.B. Jung, Microelec. Rel. 46, 535 (2006)

    Article  Google Scholar 

  18. J.W. Kim, S.B. Jung, Microelec. Eng. 82, 554 (2005)

    Article  Google Scholar 

  19. H. Ye, C. Basaran, D.C. Hopkins, Inter. J. Solid. Struct. 41, 4959 (2004)

    Article  Google Scholar 

  20. C.J. Zhai, Sidharth, R. Blish II, IEEE Trans. Device Mater. Rel. 3, 207 (2003)

    Article  Google Scholar 

  21. M.P. Rodriquez, N.Y.A. Shammas, A.T. Plumpton, D. Newcombe, D.E. Crees, Microelec. Rel. 40, 455 (2000)

    Article  Google Scholar 

  22. J.H. Lau, IEEE Trans. Comp., Pack., Manuf. Tech. B 19, 728 (1996)

    Article  Google Scholar 

  23. V. Sarihan, IEEE Trans. Comp., Pack., Manuf. Tech. B 17, 626 (1994)

    Article  Google Scholar 

  24. C.G. Schmidt, J.W. Simons, C.H. Kanazawa, D.C. Elrich, IEEE Trans. Comp., Pack., Manuf. Tech. A 18, 611 (1995)

    Article  Google Scholar 

  25. B.Z. Hong, J. Elec. Mater. 26, 814 (1997)

    Google Scholar 

  26. B.Z. Hong, J. Elec. Mater. 28, 1071 (1999)

    Article  Google Scholar 

  27. B.Z. Hong, L.G. Burrell, IEEE Trans. Comp., Pack., Manuf. Tech. A 18, 585 (1995)

    Article  Google Scholar 

  28. S.C. Chen, Y.C. Lin, C.H. Cheng, J. Mater. Proc. Tech. 171, 125 (2006)

    Article  Google Scholar 

  29. E.E. Underwood, in Quantitative Microscopy, ed. by R.T Dehoof, F.N. Rhines (McGraw-Hill, New York, 1968), p. 149

    Google Scholar 

  30. B. Wunsch, X. Deng, N. Chawla, in Computational Methods in Materials Characterisation, ed. by A.A. Mammoli, C.A. Brebbia (WIT Press, Boston, 2004), pp. 175–184

    Google Scholar 

  31. R.S. Sidhu, N. Chawla, Mater. Charact. 52, 225 (2004)

    Article  Google Scholar 

  32. M. Li, S. Ghosh, T.N. Rouns, H. Weiland, O. Richmond, W. Hunt, Mater. Charact. 41, 81 (1998)

    Article  Google Scholar 

  33. M. Li, S. Ghosh, O. Richmond, H. Weiland, T.N. Rouns, Mater. Sci. Eng. A 265, 153 (1999)

    Article  Google Scholar 

  34. M.V. Kral, M.A. Mangan, G. Spanos, R.O. Rosenberg, Mater. Charact. 45, 17 (2000)

    Article  Google Scholar 

  35. T. Yokomizo, M. Enomoto, O. Umezawa, G. Spanos, R.O. Rosenberg, Mater. Sci. Eng. A 344, 261 (2003)

    Article  Google Scholar 

  36. C.Y. Hung, G. Spanos, R.O. Rosenberg, M.V. Kral, Acta Mater. 50, 3781 (2002)

    Article  Google Scholar 

  37. A.C. Lund, P.W. Voorhees, Acta Mater. 50, 2582 (2002)

    Google Scholar 

  38. K.M. Wu, M. Enomoto, Scripta Mater. 46, 569 (2002)

    Article  Google Scholar 

  39. M. Yamaguchi, S.K. Biswas, Y. Suzuki, H. Furukawa, K. Takeo, FEMS Microbio. Lett. 219, 17 (2003)

    Article  Google Scholar 

  40. A. Tewari, A.M. Gokhale, Mater. Charact. 46, 329 (2001)

    Article  Google Scholar 

  41. M.V. Kral, G. Spanos, Acta Mater. 47, 711 (1999) Fig.

    Article  Google Scholar 

  42. J. Alkemper, P.W. Voorhees, Acta Mater. 49, 897 (2001)

    Article  Google Scholar 

  43. N. Chawla, K.K. Chawla, J. Mater. Sci. 41, 913–925 (2006)

    Article  Google Scholar 

  44. N. Chawla, V.V. Ganesh, B. Wunsch, Scripta Mater. 51, 161 (2004)

    Article  Google Scholar 

  45. N. Chawla, R.S. Sidhu, V.V. Ganesh, Acta Mater. 54, 1541 (2006)

    Article  Google Scholar 

  46. X. Deng, N. Chawla, K.K. Chawla, M. Koopman, Acta Mater. 52, 4291 (2004)

    Article  Google Scholar 

  47. W. Yang, L.E. Felton, R.W. Messler, J. Electron. Mater. 24, 1465 (1995)

    Google Scholar 

  48. K.N. Tu, R.D. Thompson, Acta Metall. 30, 947 (1982)

    Article  Google Scholar 

  49. X. Deng, G. Piotrowski, J.J. Williams, N. Chawla, J. Electron. Mater. 32, 1403 (2003)

    Article  Google Scholar 

  50. K.H. Prakash, T. Sritharan, Acta Mater. 49, 2481 (2001)

    Article  Google Scholar 

  51. W.K. Choi, H.M. Lee, J. Electron. Mater. 29, 1207 (2000)

    Article  Google Scholar 

  52. F. Guo, S. Choi, J.P. Lucas, K.N. Subramanian, J. Electron. Mater. 29, 1241 (2000)

    Article  Google Scholar 

  53. D. Ma, W.D. Wang, S.K. Lahiri, J. Appl. Phys. 91, 3312 (2002)

    Article  Google Scholar 

  54. C.R. Kao, Mater. Sci. Eng. A 238, 196 (1997)

    Article  Google Scholar 

  55. S. Chada, R.A. Fournelle, W. Laub, D. Shangguan, J. Electron. Mater. 29, 1214 (2000)

    Article  Google Scholar 

  56. Z. Mei, A.J. Sunwoo, J.W. Morris Jr, Metall. Trans. A 23, 857 (1992)

    Google Scholar 

  57. W.K. Choi, H.M. Lee, J. Electron. Mater 29, 1207 (2000)

    Article  Google Scholar 

  58. H. Lee, M. Chen, H. Jao, T. Liao, Mater. Sci. Eng. A 358, 134 (2003)

    Article  Google Scholar 

  59. Y.C. Chan, A.C.K. So, J.K.L. Lai, Mater. Sci. Eng. B 55, 5 (1998)

    Article  Google Scholar 

  60. H.L.J. Pang, K.H. Tan, X.W. Shi, Z.P. Wang, Mater. Sci. Eng. A 307, 42 (2001)

    Article  Google Scholar 

  61. H.W. Miao, J.G. Duh, Mater. Chem. Phys. 71, 255 (2001)

    Article  Google Scholar 

  62. P. Protsenko, A. Terlain, V. Traskine, N. Eustathopoulos, Scripta Mater. 45, 1439 (2001)

    Article  Google Scholar 

  63. D.R. Frear, JOM 48, 49 (1996)

    Google Scholar 

  64. R.E. Pratt, E.I. Stromswold, D.J. Quesnel, J. Electron. Mater. 23, 375 (1994)

    Google Scholar 

  65. C.K. Alex, Y.C. Chan, IEEE Trans. CPMT-B 19, 661 (1996)

    Google Scholar 

  66. P.L. Tu, Y.C. Chan, J.K.L. Lai, IEEE Trans. CPMT-B 20, 87 (1997)

    Google Scholar 

  67. X. Deng, R.S. Sidhu, P. Johnson, N. Chawla, Metall. Mater. Trans A 36, 55 (2005)

    Article  Google Scholar 

  68. X. Deng, M. Koopman, N. Chawla, K.K. Chawla, Mater. Sci. Eng. 364, 241 (2004)

    Google Scholar 

  69. M.A. James, D. Swenson, FRANC2D/L: A Crack Propagation Simulator for Plane Layered Structures, available from http://www.mne.ksu.edu/~franc2d/.

    Google Scholar 

  70. V.V. Ganesh, N. Chawla, Mater. Sci. Eng. A 391, 342 (2005)

    Article  Google Scholar 

  71. E.F. Rybicki, M.F. Kanninen, Eng. Frac. Mech. 9, 931 (1977)

    Article  Google Scholar 

  72. F. Erdogan, G.C. Sih, J. Basic Eng. (1963) 519

    Google Scholar 

  73. A. Ayyar, N. Chawla, Comp. Sci. Tech. 66, 1980 (2006)

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. School of Materials, Fulton School of Engineering, Arizona State University, Tempe, AZ, 85287-8706, USA

    N. Chawla & R. S. Sidhu

Authors
  1. N. Chawla
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. R. S. Sidhu
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

Copyright information

© 2006 Springer Science+Business Media, LLC

About this chapter

Cite this chapter

Chawla, N., Sidhu, R.S. (2006). Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys. In: Lead-Free Electronic Solders. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-48433-4_11

Download citation

  • DOI: https://doi.org/10.1007/978-0-387-48433-4_11

  • Published:

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-387-48431-0

  • Online ISBN: 978-0-387-48433-4

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics

Search

Navigation