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Electromigration in Flip Chip Solder Joints

  • King-Ning Tu
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 117)

Abstract

In 1998, Brandenburg and Yeh reported electromigration failure in fiip chip eutectic SnPb solder joints [1]. Using a current density of 8 × 103 A/cm2 at 150°C for about 100 hr, they detected failure by the formation of a pancake type of void across the entire cathode contact to the Si chip. In addition, a significant amount of phase separation in the bulk of the eutectic solder bump was observed; the Pb has moved to the anode side and the Sn to the cathode side.

Keywords

Solder Joint Solder Bump Back Stress Composite Solder Joint Current Crowding 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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Copyright information

© Springer 2007

Authors and Affiliations

  • King-Ning Tu
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of California at Los AngelesLos AngelesUSA

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