Electromigration in Flip Chip Solder Joints
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In 1998, Brandenburg and Yeh reported electromigration failure in fiip chip eutectic SnPb solder joints . Using a current density of 8 × 103 A/cm2 at 150°C for about 100 hr, they detected failure by the formation of a pancake type of void across the entire cathode contact to the Si chip. In addition, a significant amount of phase separation in the bulk of the eutectic solder bump was observed; the Pb has moved to the anode side and the Sn to the cathode side.
KeywordsSolder Joint Solder Bump Back Stress Composite Solder Joint Current Crowding
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