Electromigration in Flip Chip Solder Joints

  • King-Ning Tu
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 117)


In 1998, Brandenburg and Yeh reported electromigration failure in fiip chip eutectic SnPb solder joints [1]. Using a current density of 8 × 103 A/cm2 at 150°C for about 100 hr, they detected failure by the formation of a pancake type of void across the entire cathode contact to the Si chip. In addition, a significant amount of phase separation in the bulk of the eutectic solder bump was observed; the Pb has moved to the anode side and the Sn to the cathode side.


Solder Joint Solder Bump Back Stress Composite Solder Joint Current Crowding 
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© Springer 2007

Authors and Affiliations

  • King-Ning Tu
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of California at Los AngelesLos AngelesUSA

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