Abstract
In 1998, Brandenburg and Yeh reported electromigration failure in fiip chip eutectic SnPb solder joints [1]. Using a current density of 8 × 103 A/cm2 at 150°C for about 100 hr, they detected failure by the formation of a pancake type of void across the entire cathode contact to the Si chip. In addition, a significant amount of phase separation in the bulk of the eutectic solder bump was observed; the Pb has moved to the anode side and the Sn to the cathode side.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
S. Brandenburg and S. Yeh, Proceedings of Surface Mount International Conference and Exhibition, SMI98, San Jose, CA, Aug. 1998, p. 337– 344.
C. Y. Liu, C. Chen, C. N. Liao, and K. N. Tu, “Microstructure–electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes,” Appl. Phys. Lett., 75, 58–60 (1999).
C. Y. Liu, C. Chen, and K. N. Tu, “Electromigraiton of thin strips of SnPb solder as a function of composition,” J. Appl. Phys., 88, 5703–5709 (2000).
T. Y. Lee, K. N. Tu, S. M. Kuo, and D. R. Frear, “Electromigration of eutectic SnPb solder interconnects for flip chip technology,” J. Appl. Phys., 89, 3189–3194 (2001).
T. Y. Lee, K. N. Tu, and D. R. Frear, “Electromigration of eutectic SnPb and SnAgCu flip chip solder bumps and under-bump-metallization,” J. Appl. Phys., 90, 4502–4508 (2001).
K. N. Tu, “Recent advances on electromigration in very-large-scale-integration of interconnects,” J. Appl. Phys., 94, 5451–5473 (2003).
W. D. Callister, Jr., “Materials Science and Engineering: An Introduction,” 5th ed., Wiley, New York (2000). Chapter 6 (Table 6.1) and Appendix B (Table B.2)
E. C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan, “Current-crowding-induced electromigration failure in flip chip solder joints,” Appl. Phys. Lett., 80, 580–582 (2002).
W. J. Choi, E. C. C. Yeh, and K. N. Tu, “Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/AlAl thin film under-bump metallization,” J. Appl. Phys., 94, 5665–5671 (2003).
H. Gan, W. J. Choi, G. Xu, and K. N. Tu, “Electromigration in flip chip solder joints and solder lines,” JOM, 6, 34–37 (2002).
L. Zhang, S. Ou, J. Huang, K. N. Tu, S. Gee, and L. Nguyen, “Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints, “ Appl. Phys. Lett., 88, 012106 (2006).
J. W. Nah, K. W. Paik, J. O. Suh, and K. N. Tu, “Mechanism of electromigration induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints,”J. Appl. Phys., 94, 7560–7566 (2003).
Y. C. Hu, Y. L. Lin, C. R. Kao, and K. N. Tu, “Electromigration failure in flip chip solder joints due to rapid dissolution of Cu,” J. Mater. Res., 18, 2544–2548 (2003).
Y. H. Lin, C. M. Tsai, Y. C. Hu, Y. L. Lin, and C. R. Kao, “Electromigration induced failure in flip chip solder joints,” J. Electron. Mater., 34, 27–33 (2005). (Dissolution of thick Cu UBM)
L. Xu, J. Pang, and K. N. Tu, Appl. Phys. Lett., to be published.
J. R. Black, Proc. IEEE, 57, 1587 (1969).
M. Shatzkes and J. R. Lloyd, J. Appl. Phys., 59, 3890 (1986).
N. F. Mott and H. Jones, “The Theory of the Properties of Metals and Alloys,” Dover, New York, p. 242 (1958). (Wiedemann-Franz law)
A. T. Huang, Ph.D. dissertation, UCLA (2006).
F. Y. Ouyang, Personal communication.
J. W. Nah, J. O. Suh, and K. N. Tu, “Effect of current crowding and joule heating on electromigration induced failure in flip chip composite solder joints tested at room temperature,” J. Appl. Phys., 98, 013715 (2005).
J. W. Nah, J. O. Suh, K. N. Tu, S. W. Yoon, V. S. Rao, K. Vaidyanathan, and F. Hua, “Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect,” J. Appl. Phys., 100, 123513 (2006).
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2007 Springer
About this chapter
Cite this chapter
Tu, KN. (2007). Electromigration in Flip Chip Solder Joints. In: Solder Joint Technology. Springer Series in Materials Science, vol 117. Springer, New York, NY. https://doi.org/10.1007/978-0-387-38892-2_9
Download citation
DOI: https://doi.org/10.1007/978-0-387-38892-2_9
Publisher Name: Springer, New York, NY
Print ISBN: 978-0-387-38890-8
Online ISBN: 978-0-387-38892-2
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)