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Solder Reactions on Nickel, Palladium, and Gold

  • King-Ning Tu
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 117)

Abstract

In this chapter we shall discuss solder reaction with Ni, Pd, and Au. These metals and Cu are being used in under-bump metallization (UBM) or in bond pad, yet the role of Cu and Ni differs from that of Pd and Au. For Cu and Ni, the formation of intermetallic compound (IMC) of Cu-Sn or Ni-Sn is chosen so as to achieve metallic bonds in a solder joint. For Pd and Au, they have been used as surface coating to passivate the surface of Cu and Ni as well as to enhance wetting reaction. Typically, the surface of Cu is protected by a thin film of Au and that of Ni is protected by a film of Pd. Often Au is used on Ni too.

Keywords

Solder Joint Solder Bump Molten Solder Eutectic SnPb Eutectic SnPb Solder 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer 2007

Authors and Affiliations

  • King-Ning Tu
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of California at Los AngelesLos AngelesUSA

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