Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops
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In Chapter 2, we demonstrated that in the wetting reaction of a cap of molten eutectic SnPb solder on a bulk Cu foil, the intermetallic compound formation of Cu6Sn5 takes a unique morphology of closely distributed scallops. Morphology controls kinetics. The kinetics of growth of the scallops is a supply-controlled reaction, rather than di.usion-controlled or interfacialreaction- controlled.
KeywordsMolten Solder Growth Exponent Wetting Reaction SnPb Solder Solder Composition
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