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Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops

  • King-Ning Tu
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 117)

Abstract

In Chapter 2, we demonstrated that in the wetting reaction of a cap of molten eutectic SnPb solder on a bulk Cu foil, the intermetallic compound formation of Cu6Sn5 takes a unique morphology of closely distributed scallops. Morphology controls kinetics. The kinetics of growth of the scallops is a supply-controlled reaction, rather than di.usion-controlled or interfacialreaction- controlled.

Keywords

Molten Solder Growth Exponent Wetting Reaction SnPb Solder Solder Composition 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer 2007

Authors and Affiliations

  • King-Ning Tu
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of California at Los AngelesLos AngelesUSA

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