Abstract
In Chapter 2, we demonstrated that in the wetting reaction of a cap of molten eutectic SnPb solder on a bulk Cu foil, the intermetallic compound formation of Cu6Sn5 takes a unique morphology of closely distributed scallops. Morphology controls kinetics. The kinetics of growth of the scallops is a supply-controlled reaction, rather than di.usion-controlled or interfacialreaction- controlled.
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References
I. M. Lifshiz and V. V. Slezov, “The kinetics of precipitation from supersaturated solid solutions,” J. Phys. Chem. Solids, 19 (1/2), 35–50 (1961).
C. Wagner, Z. Electrochem., 65, 581 (1961).
V. V. Slezov, “Theory of Diffusion Decomposition of Solid Solution,” Harwood Academic Publishers, Newark, NJ, pp. 99–112 (1995).
K. N. Tu, F. Ku, and T. Y. Lee, “Morphology stability of solder reaction products in flip chip technology,” J. Electron. Mater., 30, 1129–1132 (2001).
K. N. Tu, T. Y. Lee, J. W. Jang, L. Li, D. R. Frear, K. Zeng, and J. K. Kivilahti, “Wetting reaction vs. solid state aging of eutectic SnPb on Cu,” J. Appl. Phys., 89, 4843–4849 (2001).
H. Foell, P. S. Ho, and K. N. Tu, “Cross-sectional TEM of silicon-silicide interfaces,” J. Appl. Phys, 52, 250 (1981).
H. Foell, P. S. Ho, and K. N. Tu, “Transmission electron microscopy of the formation of nickel silicides,” Philos. Mag. A, 45, 32 (1982).
K. N. Tu, W. K. Chu, and J. W. Mayer, “Structure and growth kinetics of Ni2Si on Si,” Thin Solid Films, 25, 403 (1975).
K.N. Tu, “Selective growth of metal-rich silicide of near noble metals,” Appl. Phys. Lett., 27, 221 (1975).
U. Gosele and K. N. Tu, “Growth kinetics of planar binary diffusion couples: Thin film case versus bulk cases,” J. Appl. Phys., 53, 3252 (1982).
S. Herd, K. N. Tu, and K. Y. Ahn, “Formation of an amorphous Rh-Si alloy by interfacial reaction between amorphous Si and crystalline Rh thin films,” Appl. Phys. Lett., 42, 597 (1983).
S. Newcomb and K. N. Tu, “TEM study of formation of amorphous NiZr alloy by solid state reaction,” Appl. Phys. Lett., 48, 1436–1438 (1986).
D. Turnbull, “Meta-stable structure in metallurgy,” Metall. Trans. A, 12, 695–708 (1981).
H. K. Kim and K. N. Tu, “Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening,” Phys. Rev. B, 53, 16027–16034 (1996).
A. M. Gusak and K. N. Tu, “Kinetic theory of flux-driven ripening,” Phys. Rev. B, 66, 115403-1 to -14 (2002).
K. N. Tu, A. M. Gusak, and M. Li, “Physics and materials challenges for Pb-free solders,” J. Appl. Phys., 93, 1335–1353 (2003). (Review paper)
J. O. Suh, Ph.D. dissertation, UCLA (2006).
K. A. Jackson, “Current concepts in crystal growth from the melt,” in “AlProgress in Solid State Chemistry,” H. Reiss (Ed.), Pergamon Press, New York, pp. 53–80 (1967).
D. P. Woodruff, “The Solid–Liquid Interface,” Cambridge University Press, London (1973).
C. Y. Liu and K. N. Tu, “Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition,” J. Mater. Res., 13, 37–44 (1998).
G. Ghosh, “Coarsening kinetics of Ni3Sn4 scallops during interfacial reaction between liquid eutectic solders and Cu/Ni/Pd metallization,” J. Appl. Phys., 88, 6887–6896 (2000).
J. Görlich, G. Schmitz, and K. N. Tu, “On the mechanism of the binary Cu/Sn solder reaction,” Appl. Phys. Lett., 86, 053106 (2005).
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Tu, KN. (2007). Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops. In: Solder Joint Technology. Springer Series in Materials Science, vol 117. Springer, New York, NY. https://doi.org/10.1007/978-0-387-38892-2_5
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DOI: https://doi.org/10.1007/978-0-387-38892-2_5
Publisher Name: Springer, New York, NY
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