Copper–Tin Reactions in Flip Chip Solder Joints

  • King-Ning Tu
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 117)


In Chapters 2 and 3, we discussed solder reactions on bulk and thin-film Cu, respectively. In those reactions, there is only one interface between the solder and the Cu. However, in a solder joint there are two interfaces. Typically a solder joint joins two pieces of Cu tube together as in plumbing, or it joins two metallic contacts as in Si devices. These two interfaces in a fiip chip solder joint are not independent of each other from the point of view of interfacial reactions.


Solder Joint Solder Ball Solder Bump Eutectic Solder Composite Solder Joint 
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Copyright information

© Springer 2007

Authors and Affiliations

  • King-Ning Tu
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of California at Los AngelesLos AngelesUSA

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