Copper–Tin Reactions in Flip Chip Solder Joints
- 2.5k Downloads
In Chapters 2 and 3, we discussed solder reactions on bulk and thin-film Cu, respectively. In those reactions, there is only one interface between the solder and the Cu. However, in a solder joint there are two interfaces. Typically a solder joint joins two pieces of Cu tube together as in plumbing, or it joins two metallic contacts as in Si devices. These two interfaces in a fiip chip solder joint are not independent of each other from the point of view of interfacial reactions.
KeywordsSolder Joint Solder Ball Solder Bump Eutectic Solder Composite Solder Joint
Unable to display preview. Download preview PDF.
- D. V. Ragone, “Thermodynamics of Materials,” Volume II, Chapter 8, John Wiley, New York (1995).Google Scholar
- A. Huang, Ph.D. dissertation, UCLA (2006).Google Scholar
- J. W. Nah, UCLA, Personal communication.Google Scholar
- D. Post, B. Han, and P. Ifju, “High Sensitivity Moire: Experimental Analysis for Mechanics and Materials,” Springer, Berlin (1994).Google Scholar