Abstract
In Chapters 2 and 3, we discussed solder reactions on bulk and thin-film Cu, respectively. In those reactions, there is only one interface between the solder and the Cu. However, in a solder joint there are two interfaces. Typically a solder joint joins two pieces of Cu tube together as in plumbing, or it joins two metallic contacts as in Si devices. These two interfaces in a fiip chip solder joint are not independent of each other from the point of view of interfacial reactions.
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Tu, KN. (2007). Copper–Tin Reactions in Flip Chip Solder Joints. In: Solder Joint Technology. Springer Series in Materials Science, vol 117. Springer, New York, NY. https://doi.org/10.1007/978-0-387-38892-2_4
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DOI: https://doi.org/10.1007/978-0-387-38892-2_4
Publisher Name: Springer, New York, NY
Print ISBN: 978-0-387-38890-8
Online ISBN: 978-0-387-38892-2
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