Abstract
On a silicon chip, thin-film under-bump metallization (UBM) is needed to join the solder bump to the Al or Cu wiring on the chip and also to control the size of the solder bump. This is because the oxide on a free Al surface prevents the wetting of molten solder. On the other hand, Cu reacts extremely fast with molten solder, therefore the Cu thin-film wiring cannot be wetted by molten solder.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
K. N. Tu, “Interdiffusion and reaction in bimetallic Cu-Sn thin films,” Acta Metall., 21, 347 (1973).
J. W. Mayer, J. M. Poate, and K. N. Tu, “Thin films and solid-phase reactions,” Science, 190, 228–234 (1975). J. M. Poate and K. N. Tu, “Thin film and interfacial analysis,” Physics Today, May (1980), p.34.
K. N. Tu and R. D. Thompson, “Kinetics of interfacial reaction in bimetallic Cu-Sn thin films,” Acta Metall., 30, 947 (1982).
K. N. Tu and J. W. Mayer, “Silicide formation,” in Thin Films—Inter-diffusion and Reactions, J.M. Poate, K.N. Tu, and J.W. Mayer (Eds.), John Wiley, New York (1978).
U. Gosele and K.N. Tu, “Growth kinetics of planar binary diffusion couples: Thin film case versus bulk cases,” J. Appl. Phys., 53, 3252 (1982).
G. V. Kidson, “Some aspects of the growth of different layers in binary systems,” J. Nucl. Mater., 3, 21 (1961).
D. A. Porter and K. E. Easterling, “Phase Transformation in Metals and Alloys,” Chapman & Hall, London (1992).
A. A. Liu, H. K. Kim, K. N. Tu, and P. A. Totta, “Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films,” J. Appl. Phys., 80, 2774–2780 (1996).
C. Y. Liu, H. K. Kim, K. N. Tu, and P. A. Totta, “Dewetting of molten Sn on Au/Cu/Cr thin film metallization,” Appl. Phys. Lett., 69, 4014–4016 (1996).
D. W. Zheng, Z. Y. Jia, C. Y. Liu, W. Wen, and K. N. Tu, “Size dependent dewetting and sideband reaction of eutectic SnPb on Au/Cu/Cr thin film,” J. Mater. Res., 13, 1103–1106 (1998).
D. W. Zheng, W. Wen, K. N. Tu, and P. A. Totta, “In-situ scanning electron microscopy study of eutectic SnPb and pure Sn wetting on Au/Cu/Cr multilayered thin films,” J. Mater. Res., 14, 745–749 (1999).
K. Puttlitz and P. Totta, “Area Array Technology Handbook for Microelectronic Packaging,” Kluwer Academic, Norwell, MA (2001).
G. Z. Pan, A. A. Liu, H. K. Kim, K. N. Tu, and P. A. Totta, “Microstructure of phased-in Cr-Cu/Cu/Au bump-limiting-metallization and its soldering behavior with high Pb and eutectic SnPb solders,” Appl. Phys. Lett., 71, 2946–2948 (1997).
J. W. Jang, L. N. Ramanathan, J. K. Lin, and D. R. Frear, “Spalling of Cu3Sn intermetallics in high-Pb 95Pb5Sn solder bumps on Cu under-bump-metallization during solid-state annealing,” J. Appl. Phys., 95, 8286–8289 (2004).
C. Y. Liu, K. N. Tu, T. T. Sheng, C. H. Tung, D. R. Frear, and P. Elenius, “Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization,” J. Appl. Phys., 87, 750–754 (2000).
M. Li, F. Zhang, W. T. Chen, K. Zeng, K. N. Tu, H. Balkan, and P. Elenius, “Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films,” J. Mater. Res., 17, 1612–1621 (2002).
Y. Wang and K. N. Tu, “Ultra-fast intermetallic compound formation between eutectic SnPb and Pd where the intermetallic is not a diffusion barrier,” Appl. Phys. Lett., 67, 1069–1071 (1995).
P. G. Kim and K. N. Tu, “Morphology of wetting reaction of eutectic SnPb solder on Au foils,” J. Appl. Phys., 80, 3822–3827 (1996).
C. Y. Liu and K. N. Tu, “Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition,” J. Mater. Res., 13, 37–44 (1998).
C. Y. Liu and K. N. Tu, “Reactive flow of molten Pb(Sn) alloys in Si grooves coated with Cu film,” Phys. Rev. E, 58, 6308–6311 (1998).
F. H. Howie and E. D. Hondros, J. Mater. Sci., 17, 1434 (1982).
J. A. Mann, Jr., L. Romero, R. R. Rye, and F. G. Yost, “Flow of simple liquids down narrow V- grooves,” Phys. Rev. E, 52, 3967–3972 (1995).
Author information
Authors and Affiliations
Rights and permissions
Copyright information
© 2007 Springer
About this chapter
Cite this chapter
Tu, KN. (2007). Copper–Tin Reactions in Thin-Film Samples. In: Solder Joint Technology. Springer Series in Materials Science, vol 117. Springer, New York, NY. https://doi.org/10.1007/978-0-387-38892-2_3
Download citation
DOI: https://doi.org/10.1007/978-0-387-38892-2_3
Publisher Name: Springer, New York, NY
Print ISBN: 978-0-387-38890-8
Online ISBN: 978-0-387-38892-2
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)