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Copper–Tin Reactions in Bulk Samples

  • King-Ning Tu
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 117)

Abstract

Solder reaction is the wetting of a molten solder on a solid Cu surface. Typically, when a small drop of molten solder touches a large Cu surface, it spreads and forms a cap on the Cu surface. The cap has a stable wetting angle, which is defined usually by Young’s equation for a triple point.

Keywords

Solder Joint Solder Bump Molten Solder Kirkendall Void Wetting Reaction 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer 2007

Authors and Affiliations

  • King-Ning Tu
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of California at Los AngelesLos AngelesUSA

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