Abstract
Solder reaction is the wetting of a molten solder on a solid Cu surface. Typically, when a small drop of molten solder touches a large Cu surface, it spreads and forms a cap on the Cu surface. The cap has a stable wetting angle, which is defined usually by Young’s equation for a triple point.
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Tu, KN. (2007). Copper–Tin Reactions in Bulk Samples. In: Solder Joint Technology. Springer Series in Materials Science, vol 117. Springer, New York, NY. https://doi.org/10.1007/978-0-387-38892-2_2
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DOI: https://doi.org/10.1007/978-0-387-38892-2_2
Publisher Name: Springer, New York, NY
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