Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration
Concerning the mechanical properties of solder joints, there are two unique characteristics worth mentioning again and again. The first is that solder alloys have a very high homologous temperature at the device working temperature or at room temperature.
KeywordsSolder Joint Solder Ball Solder Bump Drop Test Charpy Impact Test
Unable to display preview. Download preview PDF.
- J. M. Holt (Ed.), “Charpy Impact Test: Factors and Variables,” ASTM STP 1072, Philadelphia, PA (1990).Google Scholar
- T. Shoji, K. Yamamoto, R. Kajiwara, T. Morita, K. Sato, and M. Date, Proceedings of the 16th JIEP Annual Meeting, 2002, p. 97.Google Scholar
- M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K. N. Tu, “Impact reliability of solder joints,” Proceedings of the 54th ECTC, Las Vegas, NV, June 2004, pp. 668–674.Google Scholar
- S. Ou, Y. Xu, K. N. Tu, M. O. Alam, and Y. C. Chan, “A study of impact reliability of lead-free BGA balls on Au/electrolytic Ni/Cu bond pad,” MRS 2005 Spring Meeting Proceedings, Symposium B, 10.5.Google Scholar
- M. Alajok, L. Nguyen, and J. Kivilakti, “Drop test reliability of wafer level chip scale packages,” IEEE 2005, Electronic Components and Technology Conference, pp. 637–643.Google Scholar
- E. H. Wong, Y.-W. Mai, and S. K. W. Seah, “Board level drop impact—fundamental and parametric analysis,” Trans. ASME, 127, 496–502 (2005).Google Scholar
- M. Roseau, “Vibrations in Mechanical System,” pp. 111–136, Springer-Verlag, Berlin 1987.Google Scholar
- L. Meirovitch, “Fundamentals of Vibrations,” pp. 14–39, McGraw–Hill Higher Education, New York (2001).Google Scholar
- W. Goldsmith, “Impact: The Theory and Physical Behavior of Colliding Solids,” Edward Arnold Publishers, London (1960).Google Scholar
- J. J. Tuma, “Handbook of Physical Calculations,” 2nd Enlarged & Revised Ed., pp. 311–312, McGraw–Hill, New York (1983).Google Scholar