Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration
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Concerning the mechanical properties of solder joints, there are two unique characteristics worth mentioning again and again. The first is that solder alloys have a very high homologous temperature at the device working temperature or at room temperature.
KeywordsSolder Joint Solder Ball Solder Bump Drop Test Charpy Impact Test
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