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Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration

  • King-Ning Tu
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 117)

Abstract

Concerning the mechanical properties of solder joints, there are two unique characteristics worth mentioning again and again. The first is that solder alloys have a very high homologous temperature at the device working temperature or at room temperature.

Keywords

Solder Joint Solder Ball Solder Bump Drop Test Charpy Impact Test 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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Copyright information

© Springer 2007

Authors and Affiliations

  • King-Ning Tu
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of California at Los AngelesLos AngelesUSA

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