Polarity Effect of Electromigration on Solder Reactions

  • King-Ning Tu
Part of the Springer Series in Materials Science book series (SSMATERIALS, volume 117)


In fiip chip solder joints, electromigration-induced failure is dominated by current crowding at the cathode area of contact. The high current density in the current crowding region enhances the dissolution of UBM at the cathode and transforms Cu to Cu3Sn and to Cu6Sn5 and finally leads to void formation and failure; the interaction between electrical force and chemical force is a key factor in the failure. To understand the interaction and to avoid the complication due to current crowding, straight V-groove samples having Cu wires as electrodes were introduced.


Solder Joint Electrical Force Cathode Side Anode Side Interfacial IMCs 
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Copyright information

© Springer 2007

Authors and Affiliations

  • King-Ning Tu
    • 1
  1. 1.Department of Materials Science and EngineeringUniversity of California at Los AngelesLos AngelesUSA

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