Abstract
Short product lifetime cycles, fast time to market and cost reduction as well as an increasing technical complexity are only some of the challenges developers of electromechanical microsystems are faced with. Since the fabrication of prototypes and experimental based design is a lengthy and costly process, the urgent need for appropriate Computer Aided Engineering (CAE) tools, especially numerical simulation codes, arises. Therefore, we have developed a computer aided engineering software environment for the design of microsystems containing electromechanical sensors and actuators. In this environment we are able to precisely model nearly any type of piezoelectric, electrostatic or electromagnetic transducer including an eventual coupling to a surrounding medium, either a gas, a fluid or a solid. The software even allows the modeling of major nonlinear effects arising in electromechanical transducers, such as dependence of the elastic moduli on deformation, the nonlinear magnetization curves of ferroelectric materials or the geometric nonlinearities due to large displacements.
The original version of this chapter was revised: The copyright line was incorrect. This has been corrected. The Erratum to this chapter is available at DOI: 10.1007/978-0-387-35498-9_57
Chapter PDF
Similar content being viewed by others
Keywords
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
References
Lerch, R.; Landes, H.; Kaltenhacher, M.: CAPA User Manual, Tech. Rept. 3.3, University of Linz, Altenberger Str. 69, A-4040 Linz, 1999.
Mason, W. P. (Ed.): Physical Acoustics, Vol. I - Part A, London: Academic Press, 1964
Lerch, R.: Simulations of Piezoelectric Devices by Two-and Three-Dimensional Finite Elements, IEEE Trans. on Ultras., Ferroel. and Freq. Control, Vol. 37, No. 3, 1990, pp. 233–247
Lerch, R.: Finite Element Analysis of Piezoelectric Transducers, Proc. IEEE Ultrasonics Symposium, 1988, pp. 643–654
Hughes, T. J. R.: The Finite Element Method, New Jersey: Prentice-Hall, 1987
Lerch, R.; Landes, H.; Kaarmann, H.: Finite Element Modeling qf the Pulse-Echo Behavior of Ultrasound Transducers, Proc. IEEE Ultrasonics Symposium, 1994, pp. 1021–1025
Eccardt,P.; Niederer, K; Scheiter, T.; Hierold, C.: Surface micromachined ultrasound transducer in CMOS technology, Proc. IEEE Ultrasonics Symposium, 1996, pp. 959–962
Kaltenbacher, M.; Landes, H.; Niederer, K; Lerch, R.: 3D Simulation of Controlled Micro-machined Capacitive Ultrasound Transducers,Proc. IEEE Ultrasonics Symposium, 1999 (to appear)
Kaltenhacher, M.; Landes, H.; Lerch, R.: A Finite Element /Boundary-Element Method for the Simulation of Coupled Electrostatic-Mechanical Systems,.I. Phys. III France 7, 1997, pp. 1975–1982
Biro, O.; Preis, K.: On the Use ofSlagnetic Vector Potential in the Finite Element Analysis cf Three-Dimensional Eddy Currents, IEEE Trans. on Magnetics, Vol. 25, No. 4, July 1989, pp. 3145–3159
Leonard, P.J.; Rodger, D.: Voltage forced coils fir 3D finite-element electromagnetic models, IEEE Transactions on Magnetics, Vol. 24, No, 6, November 1988 pp. 2579–2581
Kaltenbacher, M.; Landes, H.; Lerch, R.: A Strong Coupling Model far the Simulation of Mhgnetomechanical Systems using a Predictor/Multicorrector Algorithm, Applied Computational Electromagnetics Society Journal, 1997, Vol. 12, No, 2. pp. 102–106
M. Kaltenbacher, R. Lerch, H. Landes, K. Ettinger, B. Tittmann, Computer Optimization of Electromagnetic Acoustic Transducers Proc. IEEE Ultrasonics Symposium, 1999., pp. 1029–1034
M. Jung, U. Langer, Applications of multilevel methods to practical problems, Sure. Math. Ind. 1, 1991
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2000 IFIP International Federation for Information Processing
About this chapter
Cite this chapter
Lerch, R., Kaltenbacher, M., Landes, H. (2000). CAE Environment for Electromechanical Microsystems. In: Silveira, L.M., Devadas, S., Reis, R. (eds) VLSI: Systems on a Chip. IFIP — The International Federation for Information Processing, vol 34. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-35498-9_46
Download citation
DOI: https://doi.org/10.1007/978-0-387-35498-9_46
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4757-1014-4
Online ISBN: 978-0-387-35498-9
eBook Packages: Springer Book Archive