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Chemical Deposition of Copper Selenide Films in the Surface Layer of Polyamide by the use of Selenopolythionates

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Surface and Colloid Science

Part of the book series: Progress in Colloid and Polymer Science ((PROGCOLLOID,volume 116))

Abstract

Abstract Inorganic binary compounds of copper selenide, CuxSey, films are formed on polyamide (PA) by a sorption—diffusion method using potassium selenotrithionate, K2SeS2O6, as a seleniumization agent. The selenides Cu0.5Se orthorhombic, Cu1.5Se tetragonal and Cu2.0Se orthorhombic were matched on the polymer surface after treating the seleniumizated PA films with a solution of Cu(I-II) salts. Depending on the seleniumization conditions (concentration 0.03—0.3 mol dm-3, pH 2.15, 3.0 of aqueous K2SeS2O6 solutions, 60 °C) CuxSey layers on PA of different electrical resistance (0.065–416 kΩ/3) were obtained.

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Authors and Affiliations

  1. Department of Chemical Technology, Kaunas University of Technology, Radvilenu str. 19, 3028, Kaunas, Lithuania

    R. Ivanauskas & V. Janickis

Authors
  1. R. Ivanauskas
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  2. V. Janickis
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Valdemaras Razumas Björn Lindman Tommy Nylander

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© 2000 Springer-Verlag

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Ivanauskas, R., Janickis, V. (2000). Chemical Deposition of Copper Selenide Films in the Surface Layer of Polyamide by the use of Selenopolythionates. In: Razumas, V., Lindman, B., Nylander, T. (eds) Surface and Colloid Science. Progress in Colloid and Polymer Science, vol 116. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-44941-8_21

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  • DOI: https://doi.org/10.1007/3-540-44941-8_21

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-67814-4

  • Online ISBN: 978-3-540-44941-6

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