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Literatur
Bartelink D.J. (1995) A Proposed Holistic Approach to Chip, Test and Assembly Technologies for MCMs. In Proc. 1995 IEEE Multi-Chip Conf., Santa Cruz, CA
Bartelink D.J. (1996) SCR White Paper on Integrated Systems. Dissertation
Bartelink D.J. (1998) A Proposed Holistic Approach to On-Chip, Off-Chip, Test and Package Interconnections, Characterization and Metrology for ULSI Technology 1998 International Conference
DIN, EN und 12384 (1999) Bestimmung der Federbiegegrenze von Bändern. Deutsches Institut für Normung
Fritz T., Krüger C., Mokwa W., Schnakenberg U. (2000) Mechanische Charakterisierung galvanisch abgeschiedener Nickelstrukturen für die Mikrosystemtechnik, Tech. Dig. 22. Ulmer Gespräche: Innovative Mehrkomponentensysteme, Eugen G. Leutze Verlag, Bad Saulgaul, Germany, ISBN 3-87480-164-0, pp. 139–143 (2000) und Galvanotechnik 91 pp.2894–2898
Fridman, H. und Levesque, P. (1959) Reduction of Static Friction by Sonic Vibrations. Journal of Applied Physics, Bd. 30, S. 1572–1575
Fritz T., Leuerer T., Krüger C., Mokwa W., Schnakenberg U.(2000) Mechanical Properties of Electroplated Nickel, Techn. Dig. Micro Materials Micro Mat 2000, 3rd International Conference and Exhibition, Berlin, Germany, April 17–19 (2000), S.752–755. Dresden: ddp goldenbogen
Keil, A., Merl, W., Vinaricky, E., Schröder, K.-H. und Weiser (2002) J. Elektrische Kontakte, Werkstoffe und Anwendungen. Springer-Verlag, Berlin
Krüger C., Bartelink D.J., Fritz T., Leuerer T., Mokwa W., Schnakenberg U., Micro-Springs for Temporary Chip Connections, Sensors and Actuators 85 S.371–376 (2000)
Krüger C., Bartelink D.J., Fritz T., Leuerer T., Ullerich S., Mokwa W. and Schnakenberg U. (1999) Electroplated Micro-Springs for Demountable Chip Connections. Eurosensors XIII, Den Haag (1999), pp. 139, 140
Krüger C., Mokwa W. (2001) Systemgerechte Gestaltung von Montageschnittstellen in hybriden Mikrosystemen, 5. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 23./24. Okt. 2001, Chemnitz, ISBN 3-00-008201-8, pp. 215–220
Krüger C. (2004) Entwicklung temporärer Kontaktelemente für die Mikrosystemtechnik, Dissertation, Institut für Werkstoffe der Elektrotechnik 1, Prof. Dr. rer. nat. W. Mokwa, Aachen, Shaker Verlag
Leuerer T., Krüger C., Fritz T., Mokwa W., Schnakenberg U. (2000) Design Optimization for Electroplated Micro-Springs, Techn. Dig. Micro Materials Micro Mat 2000, 3rd International Conference and Exhibition, Berlin, Germany, April 17–19 (2000), S.767–770
Meissner, M. und Schorcht, H.-J. (1997) Metallfedern. Springer-Verlag, Berlin
Micron Technologies Inc. (1996) Method for Forming Contact Pins for Semiconductor Dice and Interconnects, WO 9614659
National Technology Roadmap for Semiconductors, San Jose, CA Semiconductor research Association, 1994, p. 63
New Jersey Institute of Technology (1999) Micromachined Element and Method of Fabrication Thereof, WO 9918445
Scheerer, W. (2000) Elektrisches Kontaktverhalten mikromechanischer Schaltelemente. S. 6–7. HSG Izfm Ergebnisse und Leistungen 2000
Schimkat J., Gevatter H-J., Kisewetter L. (1996) Gold-Nickel Contacts for Silicon-Microrelays, F&M 104
Tai, Y.-C. und Muller, R. (1990) Frictional Study of IC-processed Micromotors. Sensors and Actuators, Bd. A21–A23, S.180
Tewksbury S. K. and Hornak L. A. (1995) Optical Interconnects for Emerging High Performance Electronic Modules, Mikroelectronic Systems Research Center, Dept. of Electrical and Computer Engineering, West Verginia Uni.
Verification Manual, VM 26, ANSYS Handbook. SAS IP, Inc., 1996
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Mokwa, W., Spanier, G. (2005). Passive Justage zur Prüfung und Kontaktierung von Mikrosystemen. In: Dilthey, U., Brandenburg, A. (eds) Montage hybrider Mikrosysteme. VDI-Buch. Springer, Berlin, Heidelberg. https://doi.org/10.1007/3-540-27536-3_4
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DOI: https://doi.org/10.1007/3-540-27536-3_4
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